Aminophenoxycyclotriphosphazenes such as hexakis(4-aminophenoxy)cyclotriphosphazene and tris(4-aminophenoxy)-tris phenoxyclyclotriphosphazene are used as curing agents for epoxy resins. These 1,2-epoxy resins are selected from di- or polyepoxide-containing organic moieties of the formula (CH.sub.2 --CHO--CH.sub.2).sub.m --W--R--W--(CH.sub.2 CH--CH.sub.2 O).sub.m where R is diphenyldimethylmethane, diphenylmethane, bis(dibromophenyl)dimethylmethane, or ##STR1## W is a nitrogen or oxygen atom; and m is 1 when W is oxygen and 2 when W is nitrogen. The resins are cured thermally in stages at between about 110.degree. to 135.degree. C. for between about 1 and 10 min, then at between about 175.degree. to 185.degree. C. for between about 0.5 to 10 hr and post-cured at between about 215.degree. and 235.degree. C. for between abut 0.1 and 2 hr. These resins are useful for making fire-resistant elevated temperature stable composites, laminates (e.g. graphite fiber or fiberglass), molded parts, and adhesives and structures, usually for aircraft secondary structures and for spacecraft construction.
Aminophenoxycyclotriphosphazenes,例如六(4-
氨基苯氧基)环三
磷氮和三(4-
氨基苯氧基)-三苯氧环三
磷氮,用作环氧
树脂的固化剂。这些1,2-环氧
树脂从具有以下式子的二元或多元环氧基有机基团中选择:(CH.sub.2 --CHO--CH.sub.2).sub.m --W--R--W--(CH.sub.2 CH--CH.sub.2 O).sub.m,其中R是二苯基二甲基
甲烷,二苯
甲烷,双(二
溴苯基)二甲基
甲烷,或##STR1##W是氮或氧原子;当W为氧时,m为1,当W为氮时,m为2。这些
树脂在110℃至135℃之间的阶段性热固化,时间为1至10分钟,然后在175℃至185℃之间的温度下热固化0.5至10小时,并在215℃至235℃之间进行后固化,时间为0.1至2小时。这些
树脂适用于制造耐火高温稳定的复合材料、层压板(例如石墨纤维或
玻璃纤维)、成型件、粘合剂和结构件,通常用于飞机次要结构和航天器建造。