Chemically amplified positive photoresist composition and pattern forming method using same
申请人:Ridgefield Acquisition
公开号:US11029599B2
公开(公告)日:2021-06-08
The present invention relates to a photosensitive resin composition suitable for forming a thick film, which comprises (A) an alkali-soluble resin, (B) at least one plasticizer selected from a group consisting of an alkali-soluble vinyl resin and an acid-dissociable group containing vinyl resin, (C) an acid generator, and (D) an organic solvent.