N-p-tolyl-aspartic acid | 80862-37-9

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: N-p-tolyl-aspartic acid
• 英文别名: N-p-Tolyl-asparaginsaeure；2-(4-Methylanilino)butanedioic acid
• CAS: 80862-37-9
• 化学式: C₁₁H₁₃NO₄
• 分子量: 223.229
• InChiKey: YGDMMGDUHBFELF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.9
• 重原子数：
  16
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.27
• 拓扑面积：
  86.6
• 氢给体数：
  3
• 氢受体数：
  5

反应信息

• 作为反应物：
  描述：

  N-p-tolyl-aspartic acid 在 盐酸 、 溶剂黄146 作用下， 以 水 为溶剂， 反应 11.0h， 生成 1-(p-tolyl)-3-hydroxymethyl-5-carboxymethylhydantoin
  参考文献：
  名称：

  1-Aryl-5-carboxymethylhydantoin derivatives. structure of 1-phenyl-2-thio-5-carbomethoxymethylhydantoin

  摘要：

  DOI：

  10.1007/bf00506999
• 作为产物：
  描述：

  马来酸酐 、 乙烷,三氯氟- 以 水 为溶剂， 以65 g的产率得到N-p-tolyl-aspartic acid
  参考文献：
  名称：

  1-Aryl-5-carboxymethylhydantoin derivatives. structure of 1-phenyl-2-thio-5-carbomethoxymethylhydantoin

  摘要：

  DOI：

  10.1007/bf00506999

文献信息

• THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：EP3162868A1

  公开（公告）日：2017-05-03

  Provided are a thermal base generator which is capable of performing cyclization of a thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device. The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40°C or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A1 represents a p-valent organic group, R1 represents a monovalent organic group, L1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.

  本发明提供了一种热碱发生器，它能够在低温下对热固性树脂进行环化，并用它制备出稳定性极佳的热固性树脂组合物、热固性树脂组合物、固化膜、固化膜制造方法和半导体设备。 热碱发生器包括至少一种酸性化合物和铵盐，前者在加热到 40°C 或更高温度时产生碱，后者含有 pKa1 为 0 至 4 的阴离子和铵阳离子。酸性化合物最好是铵盐和/或下式（1）所代表的化合物，其中 A1 代表 p 价有机基团，R1 代表一价有机基团，L1 代表 (m+1)- 价有机基团，m 代表 1 或 1 以上的整数，p 代表 1 或 1 以上的整数。
• BALTRUSHIS, R. S.;BERESNEVICHYUS, Z. -I. G.;VIZGAJTIS, I. M.;GATILOV, YU.+, XIMIYA GETEROTSIKL. SOEDIN., 1981, N 12, 1669-1674
  作者：BALTRUSHIS, R. S.、BERESNEVICHYUS, Z. -I. G.、VIZGAJTIS, I. M.、GATILOV, YU.+

  DOI：——

  日期：——
• BALTRUSHIS, R. S.;BERESNEVICHYUS, Z. -I. G.;VIEHGAJTIS, I. M.
  作者：BALTRUSHIS, R. S.、BERESNEVICHYUS, Z. -I. G.、VIEHGAJTIS, I. M.

  DOI：——

  日期：——
• POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION
  申请人：FUJIFILM Corporation

  公开号：US20180079864A1

  公开（公告）日：2018-03-22

  Provided are a photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition. A polyimide precursor composition in which the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole; in General Formula (1-2), A 1 and A 2 each independently represent an oxygen atom or NH, R 111 and R 112 each independently represent a single bond or a divalent organic group, and R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group.
• PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20180118887A1

  公开（公告）日：2018-05-03

  Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.