申请人:——
公开号:US20020077259A1
公开(公告)日:2002-06-20
The invention provides aqueous alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions typically contain (a) one or more metal ion-free bases at sufficient amounts to produce a pH of about 10-13 and one or more bath stabilizing agents having at least one pKa in the range of 10-13 to maintain this pH during use; (b) optionally, about 0.01 % to about 5% by weight (expressed as % SiO
2
) of a water-soluble metal ion-free silicate; (c) optionally, about 0.01% to about 10% by weight of one or more chelating agents; (d) optionally, about 0.01% to about 80% by weight of one or more water-soluble organic co-solvents; and (e) optionally, about 0.01% to about 1% by weight of a water-soluble surfactant.
本发明提供了在微电子工业中用于剥离或清洗半导体晶片基片的碱性水溶液组合物,可去除光阻残留物和其他不需要的污染物。这些组合物通常含有:(a) 一种或多种不含金属离子的碱,其用量足以产生约 10-13 的 pH 值,以及一种或多种水浴稳定剂,其至少有一种 pKa 在 10-13 范围内,以便在使用过程中保持该 pH 值;(b) 可选地,按重量计约 0.01%至约 5%(以% SiO
2
(c) 可选地,按重量计约 0.01%至约 10%的一种或多种螯合剂; (d) 可选地,按重量计约 0.01%至约 80%的一种或多种水溶性有机助溶剂;以及 (e) 可选地,按重量计约 0.01%至约 1%的水溶性表面活性剂。