N-(p-hydroxy-2-methylphenyl)maleimide | 71854-47-2

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 英文名称: N-(p-hydroxy-2-methylphenyl)maleimide
• 英文别名: 1-(4-Hydroxy-2-methylphenyl)pyrrole-2,5-dione
• CAS: 71854-47-2
• 化学式: C₁₁H₉NO₃
• 分子量: 203.197
• InChiKey: LXTUKPKZKNTFED-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  15
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.09
• 拓扑面积：
  57.6
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  N-(p-hydroxy-2-methylphenyl)maleimide 在 氯磺酸 、 potassium carbonate 、 三乙胺 作用下， 以 四氢呋喃 、 二氯甲烷 为溶剂， 反应 8.0h， 生成
  参考文献：
  名称：

  单体化合物及其制备方法、共聚物及其制备方 法和应用

  摘要：

  本发明涉及聚合物驱油技术领域，公开了一种单体化合物及其制备方法、共聚物及其制备方法和应用。本发明提供的单体化合物具有式(1)所示的结构，是一种耐温抗盐功能单体，将其引入共聚物中，能够提高共聚物的增粘性和耐温抗盐性，同时使共聚物具有一定的表面活性，能够更好地应用到油田采油过程中，

  公开号：

  CN110938026B
• 作为产物：
  描述：

  马来酸酐 、 2-甲基-4-氨基苯酚 在 三乙胺 作用下， 以 四氢呋喃 为溶剂， 反应 9.0h， 以11.99 g的产率得到N-(p-hydroxy-2-methylphenyl)maleimide
  参考文献：
  名称：

  单体化合物及其制备方法、共聚物及其制备方 法和应用

  摘要：

  本发明涉及聚合物驱油技术领域，公开了一种单体化合物及其制备方法、共聚物及其制备方法和应用。本发明提供的单体化合物具有式(1)所示的结构，是一种耐温抗盐功能单体，将其引入共聚物中，能够提高共聚物的增粘性和耐温抗盐性，同时使共聚物具有一定的表面活性，能够更好地应用到油田采油过程中，

  公开号：

  CN110938026B

文献信息

• Design and synthesis of a novel DNA-encoded chemical library using Diels-Alder cycloadditions
  作者：Fabian Buller、Luca Mannocci、Yixin Zhang、Christoph E. Dumelin、Jörg Scheuermann、Dario Neri

  DOI：10.1016/j.bmcl.2008.07.038

  日期：2008.11

  DNA-encoded chemical libraries are increasingly being employed for the identification of binding molecules to protein targets of pharmaceutical relevance. Here, we describe the synthesis and characterization of a DNA-encoded chemical library, consisting of 4000 compounds generated by Diels-Alder cycloaddition reactions. The compounds were encoded with unique DNA fragments which were generated through

  DNA编码的化学文库正越来越多地用于鉴定与药物相关的蛋白质靶标的结合分子。在这里，我们描述了由Diels-Alder环加成反应生成的4000种化合物组成的DNA编码化学文库的合成和表征。这些化合物编码有独特的DNA片段，这些片段是通过逐步组装过程生成的，并用作可扩增的条形码，用于鉴定和相对定量文库成员。
• Transparent heat-resistant resin optical material and film
  申请人：TOSOH CORPORATION

  公开号：US20040063887A1

  公开（公告）日：2004-04-01

  A transparent heat-resistant resin optical materials having excellent heat resistance and dynamic characteristics, having negative birefringence and exhibiting a high refractive index and a high Abbe number, especially optical compensating members such as films, sheets and retardation films for LCD display element. The transparent heat-resistant resin optical material is made of a copolymer containing a specific olefin residue unit and a specific N-phenyl-substituted maleimide residue unit and having a weight average molecular weight, as reduced into standard polystyrene, of from 5×10 3 to 5×10 6 , the transparent heat-resistant resin optical material exhibiting negative birefringence; and a retardation film having a relationship of three-dimensional refractive indexes of nz≧ny>nx, nz>ny≧nx, or nz>nx≧ny.

  一种具有优异耐热性和动态特性的透明耐热树脂光学材料，具有负双折射率并表现出高折射率和高阿贝数，特别是用于液晶显示元件的光学补偿元件，如薄膜、片材和减速膜。透明耐热树脂光学材料由含有特定烯烃残基单元和特定N-苯基取代马来酰亚胺残基单元的共聚物制成，其重量平均分子量在标准聚苯乙烯中降低至5×103至5×106之间，透明耐热树脂光学材料表现出负双折射率；以及具有三维折射率关系的减速膜，其中nz≧ny>nx，nz>ny≧nx，或nz>nx≧ny。
• Resin composite, semiconductor device, and method of manufacturing the semiconductor device
  申请人：FUJI ELECTRIC CO., LTD.

  公开号：US10106683B2

  公开（公告）日：2018-10-23

  A resin composite includes a maleimide resin powder and a resin having a glass transition point that is lower that the glass transition point of the maleimide resin. The resin having a glass transition point that is lower than that of the maleimide resin may be an epoxy resin. Then, the resin composite may be cured at the curing temperature of the epoxy resin. The maleimide resin powder is mixed in an amount ranging from 50 weight % to 80 weight % with respect to the epoxy resin.

  一种树脂复合材料包括马来酰亚胺树脂粉末和一种玻璃化转变点低于马来酰亚胺树脂玻璃化转变点的树脂。玻璃化转变点低于马来酰亚胺树脂玻璃化转变点的树脂可以是环氧树脂。然后，在环氧树脂的固化温度下固化树脂复合材料。马来酰亚胺树脂粉末的混合量为环氧树脂的 50% 至 80%。
• WIDE-VIEWING ANGLE COMPENSATION FILM AND TRANSMISSION TYPE LIQUID-CRYSTAL DISPLAY EMPLOYING THE SAME
  申请人：OBARA Naoto

  公开号：US20060216436A1

  公开（公告）日：2006-09-28

  A wide-viewing angle compensation film contains a polarizing plate and an optical compensation film which exhibits negative birefringence and has an in-plane retardation (Re 1 ) of 60-220 nm and an orientation parameter (Nz) in the range of 0±0.05, the optical compensation film exhibiting negative birefringence and the polarizing plate being stacked so that the slow axis of the compensation film is perpendicular or parallel to the absorption axis of the polarizing plate; and a transmission type liquid-crystal display contains a liquid-crystal cell and the wide-viewing angle compensation film disposed on at least one side of the cell.
• LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：CZUBAROW Pawel

  公开号：US20130026660A1

  公开（公告）日：2013-01-31

  A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) an epoxy resin, (B) an imidazole compound, and (C) a maleimide compound, a semiconductor device encapsulated by the liquid epoxy resin composition, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and a semiconductor die. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.