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5-乙基癸烷-5-硫醇 | 80867-37-4

中文名称
5-乙基癸烷-5-硫醇
中文别名
——
英文名称
5-Ethyldecane-5-thiol
英文别名
——
5-乙基癸烷-5-硫醇化学式
CAS
80867-37-4
化学式
C12H26S
mdl
——
分子量
202.4
InChiKey
ZRHZLIPVCIQJNE-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    5.4
  • 重原子数:
    13
  • 可旋转键数:
    8
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    1
  • 氢给体数:
    1
  • 氢受体数:
    1

文献信息

  • POLISHING COMPOSITION AND PRODUCTION METHOD THEREFOR
    申请人:Fujimi Incorporated
    公开号:EP3708630A1
    公开(公告)日:2020-09-16
    Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
    本申请提供了一种抛光组合物,该组合物含有一种水溶性聚合物,适用于降低低压差。本申请提供的抛光组合物包括一种研磨剂、一种水溶性聚合物和一种碱性化合物。在该抛光组合物中,聚合引发剂和聚合抑制剂的反应产物的含量按重量计为 0.1 ppb 或更少。
  • Adhesive composition
    申请人:TOAGOSEI CO., LTD.
    公开号:US10982115B2
    公开(公告)日:2021-04-20
    An adhesive composition according to the present invention contains a polymerizable monomer (A) and a block copolymer (B) including a polymer block (a) which includes structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b), in which the polymer block (a) and the acrylic polymer block (b) have a solubility parameter of 10.0 or more and 9.0 or more, respectively; the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a); the polymer block (a) has a glass transition temperature of 150° C. or higher; and the polymer block (b) has a glass transition temperature of 20° C. or lower.
    根据本发明的一种粘合剂组合物含有可聚合单体(A)和嵌段共聚物(B),嵌段共聚物(B)包括聚合物嵌段(a),聚合物嵌段(a)包括衍生自苯乙烯化合物和衍生自马来酰亚胺化合物的结构单元,以及丙烯酸聚合物嵌段(b),其中聚合物嵌段(a)和丙烯酸聚合物嵌段(b)的溶解度参数分别为 10.聚合物嵌段(a)含有马来酰亚胺化合物衍生的结构单元,其浓度为聚合物嵌段(a)总质量的 30% 至 99%;聚合物嵌段(a)的玻璃化转变温度为 150 摄氏度或更高;聚合物嵌段(b)的玻璃化转变温度为 20 摄氏度或更低。
  • ADHESIVE COMPOSITION
    申请人:TOAGOSEI CO., LTD.
    公开号:US20200048499A1
    公开(公告)日:2020-02-13
    An adhesive composition according to the present invention contains a polymerizable monomer (A) and a block copolymer (B) including a polymer block (a) which includes structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b), in which the polymer block (a) and the acrylic polymer block (b) have a solubility parameter of 10.0 or more and 9.0 or more, respectively; the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a); the polymer block (a) has a glass transition temperature of 150° C. or higher; and the polymer block (b) has a glass transition temperature of 20° C. or lower.
  • POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME
    申请人:FUJIMI INCORPORATED
    公开号:US20210189177A1
    公开(公告)日:2021-06-24
    Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
  • [EN] ADHESIVE COMPOSITION AND USE THEREOF<br/>[FR] COMPOSITION ADHÉSIVE ET SON UTILISATION<br/>[JA] 粘着剤組成物とその用途
    申请人:TOAGOSEI CO LTD
    公开号:WO2020032163A1
    公开(公告)日:2020-02-13
    貼り合わせ箇所が柔軟で素材の風合いを保持したまま、かつ、被着体どうしを高強度で貼り合わせることができる粘着剤組成物を提供する。ガラス転移点が50℃以上である重合体ブロック(A)、及び、ガラス転移点が10℃以下である(メタ)アクリル系重合体ブロック(B)を含むブロック共重合体を含む粘着剤組成物であって、当該粘着剤組成物を用いて形成された粘着剤層の23℃での貯蔵弾性率が0.5MPa以下である粘着剤組成物とする。
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