3,3'-Dichloro-4,4'-diphenylmethanedimaleimide | 34199-15-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3'-Dichloro-4,4'-diphenylmethanedimaleimide
• 英文别名: 1-[2-chloro-4-[[3-chloro-4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione
• CAS: 34199-15-0
• 化学式: C₂₁H₁₂Cl₂N₂O₄
• 分子量: 427.2
• InChiKey: FTFULVSESZARHS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  29
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  马来酰亚胺 、 、 N,N'-环己烷双马来亚酰胺 、 N-苯基马来酰亚胺 、 N,N'-间苯撑双马来酰亚胺 、 N,N'-(1,4-亚苯基)双马来酰亚胺 、 双马来酰亚胺 、 、 3,3'-Dichloro-4,4'-diphenylmethanedimaleimide 、 、 、 、 、 、 生成 苯胺 、 聚合甲醛 、 马来酸酐
  参考文献：
  名称：

  Maleimide: aryloxy diamine resin composition and process for producing

  摘要：

  本披露涉及一种男酰亚胺-二胺树脂组成物，该组成物对低沸点溶剂具有良好的溶解性和优异的耐热性。该组成物的特点在于包含具有以下一般式的男酰亚胺-二胺加合物：##STR1## 其中A是含有至少两个碳原子的单-, 二-, 三-或四价有机基团，R.sub.1到R.sub.6是氢原子、较低的烷基、较低的烷氧基、氯原子、溴原子、三氟甲基基团或三氯甲基基团，m为0-4的整数。

  公开号：

  US04435560A1

文献信息

• Multi-layer printed circuit board and process for production thereof
  申请人：Hitachi, Ltd.

  公开号：EP0059434A2

  公开（公告）日：1982-09-08

  A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg, and that of T92 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg, and Tg2, has excellent dimensional stability, heat resistance and through-hole reliability.

  一种通过预浸树脂片层压多个单元电路板而生产的多层印刷电路板，所述单元电路板中的固化树脂的玻璃化转变温度为 Tg1，所述预浸树脂片是用一种树脂组合物浸渍增强基板而制备的，该树脂组合物可在等于或低于预浸树脂片中树脂的玻璃化转变温度 Tg 和 T92 的温度下固化、和 T92 的温度下固化，并在等于或低于 Tg 和 Tg2 的温度下加压加热粘合层压板，从而获得具有优异尺寸稳定性、耐热性和通孔可靠性的预浸树脂板。
• Thermosetting resin composition, prepolymer thereof and cured article thereof
  申请人：Hitachi, Ltd.

  公开号：EP0078039A1

  公开（公告）日：1983-05-04

  A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.

  一种热固性树脂组合物，包含(A) 至少一种二氰胺化合物和(B) 至少一种具有一个或多个不饱和键的多价亚胺，必要时还包含(C) 至少一种环氧化合物、酚类化合物和三烯丙基异氰尿酸酯化合物中的可聚合化合物，以及通过将该组合物加热至 B 阶段进行初步反应而得到的预聚物，可以得到具有 C 级优异耐热性和柔韧性的固化产品。
• Process for producing polymaleimide
  申请人：MITSUBISHI PETROCHEMICAL CO., LTD.

  公开号：EP0099268A1

  公开（公告）日：1984-01-25

  A process for producing a polymaleimide comprises reacting an aromatic dialdehyde with 2 to 60 moles, per mole of the aromatic dialdehyde, of aromatic amine represented by the formula (I): wherein X is a hydrogen atom, a halogen atom or an alkyl or alkoxy group each having 1 to 4 carbon atoms, to obtain a polyamine, reacting the polyamine with maleic anhydride to obtain a polyamide acid, and dehydration-cyclizing the polyamide acid to obtain a polymaleimide.

  一种生产聚马来酰亚胺的工艺包括：将芳香族二甲醛与 2 至 60 摩尔（每摩尔芳香族二甲醛）的芳香族胺反应，芳香族胺由式(I)表示：其中 X 是氢原子、卤素原子或烷基或烷氧基，每个烷基或烷氧基有 1 至 4 个碳原子，得到聚胺，将聚胺与马来酸酐反应，得到聚酰胺酸，将聚酰胺酸脱水-环化，得到聚马来酰亚胺。
• Resin encapsulated semiconductor device and process for producing the same
  申请人：HITACHI, LTD.

  公开号：EP0123262A2

  公开（公告）日：1984-10-31

  The resin encapsulated semiconductor device having improved moisture resistance and thermal stability is provided with a resin encapsulation and/or resin coating of a resin material containing isomelamine rings and melamine rings.

  树脂封装半导体器件具有更好的防潮性和热稳定性，其树脂封装和/或树脂涂层是由含有异戊胺环和三聚氰胺环的树脂材料构成的。
• Thermosetting resin composition
  申请人：MITSUBISHI PETROCHEMICAL CO., LTD.

  公开号：EP0311076A2

  公开（公告）日：1989-04-12

  A thermosetting resin composition is disclosed, comprising (A) polymaleimide containing from 5 to 90% by weight, based on the total amount of the component (A), of a polyamaleimide compound represented by formula (I): wherein X represents a hydrogen atom, a halogen atom or an alkyl or alkoxy group having from 1 to 4 carbon atoms, (B) an epoxy compound having at least two epoxy groups per molecule, and (C) a curing agent for said epoxy compound, the compounding weight ratio of (A) to (B) being from 0.05/1 to 20/1, and the compounding weight ratio of (B) to (C) being from0.5/1 to 200/1. The composition exhibits improved moldability, curability and heat resistance.

  本发明公开了一种热固性树脂组合物，包括(A)聚马来酰亚胺，以组分(A)的总量为基准，含有 5%至 90%（按重量计）由式(I)代表的聚马来酰亚胺化合物： 其中 X 代表氢原子、卤素原子或具有 1 至 4 个碳原子的烷基或烷氧基，(B) 每分子至少具有两个环氧基团的环氧化合物，以及 (C) 用于所述环氧化合物的固化剂，(A)与(B)的复配重量比为 0.05/1 至 20/1，(B)与(C)的复配重量比为 0.5/1 至 200/1。该组合物具有更好的成型性、固化性和耐热性。