申请人:Mori Takahiro
公开号:US20090253887A1
公开(公告)日:2009-10-08
An epoxy resin curing composition containing a compound having a benzoxazole structure represented by formula (I):
wherein X
1
and X
2
, which may be the same or different, each represent hydrogen, a substituent having a phenolic hydroxyl group, or a substituent having an epoxy group, provided that X
1
═X
2
≠H; or X
1
and X
2
are taken together to form a 3- to 8-membered, saturated or unsaturated heterocyclic ring substituted with a substituent having a phenolic hydroxyl group or a substituent having an epoxy group; Y
1
represents oxygen or sulfur; Z
1
represents a substituted or unsubstituted C1-C8 hydrocarbon group or a substituted or unsubstituted C1-C8 alkoxy group; m is an integer of 0 to 4; when m is 2 to 4, a plurality of Z
1
s may be the same or different; n is an integer of 0 to 2; and A
1
represents hydrogen, a substituent having a phenolic hydroxyl group or a substituent having an epoxy group.