4-[2-(2-Ethyl-4-methylimidazol-1-yl)ethyl]-6-methyl-1,3,5-triazin-2-amine

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 4-[2-(2-Ethyl-4-methylimidazol-1-yl)ethyl]-6-methyl-1,3,5-triazin-2-amine
• 英文别名: 4-[2-(2-ethyl-4-methylimidazol-1-yl)ethyl]-6-methyl-1,3,5-triazin-2-amine
• 化学式: C₁₂H₁₈N₆
• 分子量: 246.31
• InChiKey: DNJUTMSZBJWDIA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  18
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  82.5
• 氢给体数：
  1
• 氢受体数：
  5

文献信息

• ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME
  申请人：LEE Jun Woo

  公开号：US20140194555A1

  公开（公告）日：2014-07-10

  An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.
• US9957425B2
  申请人：——

  公开号：US9957425B2

  公开（公告）日：2018-05-01