6-庚基-1,3,5-三嗪-2,4-二胺 | 6025-08-7

• 物质功能分类: 有机原料 - 氨基化合物
• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 中文名称: 6-庚基-1,3,5-三嗪-2,4-二胺
• 中文别名: 6-庚基-2,4-二氨基-三嗪
• 英文名称: 2,4-diamino-6-heptyl-1,3,5-triazine
• 英文别名: 6-heptyl-[1,3,5]triazine-2,4-diamine；6-heptyl-[1,3,5]triazine-2,4-diyldiamine；6-Heptyl-[1,3,5]triazin-2,4-diyldiamin；2-heptyl-4,6-diamino-1,3,5-triazine；6-Heptyl-1,3,5-triazine-2,4-diamine
• CAS: 6025-08-7
• 化学式: C₁₀H₁₉N₅
• 分子量: 209.294
• InChiKey: JWFQDKBDSOOWTB-UHFFFAOYSA-N

物化性质

• 沸点：
  436.2±28.0 °C(Predicted)
• 密度：
  1.107±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  15
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.7
• 拓扑面积：
  90.7
• 氢给体数：
  2
• 氢受体数：
  5

安全信息

• 海关编码：
  2933699090

反应信息

• 作为产物：
  描述：

  正辛腈 、 尿素 在 氨 作用下， 生成 6-庚基-1,3,5-三嗪-2,4-二胺
  参考文献：
  名称：

  US2527314

  摘要：

  公开号：

文献信息

• Triple Hydrogen Bonds Direct Crystal Engineering of Metal-Assembled Complexes: The Effect of a Novel Organic-Inorganic Module on Supramolecular Structure
  作者：Keiichi Adachi、Yuichi Sugiyama、Ko Yoneda、Koichi Yamada、Koichi Nozaki、Akira Fuyuhiro、Satoshi Kawata

  DOI：10.1002/chem.200500416

  日期：2005.11.4

  formation of complementary triply hydrogen bonded modules in the solid state. In all cases, the building module is further extended via additional hydrogen-bonding interactions to produce a tape, and tapes are assembled into sheets. These results show that a hydrogen-bonded module consisting of different kinds of building blocks, one of which is a metal complex that includes hydrogen-bond acceptor sites and

  基于[M（tdpd）2（L）2] 2-（H2tdpd = 1,4,5,6-四氢-5,6-二氧代-2,3-吡嗪二甲腈，L =溶剂）和已经合成和表征了与三聚氰胺类似的阳离子。使用包含[M（tdpd）2（L）2] 2-的两个AAA集的阴离子以及包含一个DDD集的阳离子（A =氢键受体，D =氢键供体）会导致形成互补固态的三重氢键模块。在所有情况下，建筑模块都会通过额外的氢键相互作用进一步扩展以产生胶带，然后将胶带组装成片材。这些结果表明，氢键结合的模块由不同种类的结构单元组成，其中一个是包含氢键受体位点的金属配合物，另一个是氢键供体分子，
• Medical devices employing triazine compounds and compositions thereof
  申请人：Timmer T. Richard

  公开号：US20050137196A1

  公开（公告）日：2005-06-23

  The present invention relates to methods and compositions comprising compounds that treat pathophysiological conditions arising from inflammatory responses. In particular, the present invention is directed to compounds that inhibit or block glycated protein produced induction of the signaling-associated inflammatory response in endothelial cells. The present invention relates to compounds that inhibit smooth muscle proliferation. In particular, the present invention is directed to compounds that inhibit smooth muscle cell proliferation by modulating HSPGs such as Perlecan. The present invention further relates to the use of compounds to treat vascular occlusive conditions characterized by smooth muscle proliferation such as restenosis and atherosclerosis.

  本发明涉及用于治疗由炎症反应引起的病理生理状态的化合物及组合物的方法。具体而言，本发明涉及抑制或阻断糖基化蛋白诱导内皮细胞信号相关炎症反应的化合物。本发明涉及抑制平滑肌增殖的化合物。具体而言，本发明涉及通过调节HSPGs（如Perlecan）抑制平滑肌细胞增殖的化合物。本发明还涉及使用化合物治疗平滑肌增殖的血管闭塞性疾病，如再狭窄和动脉粥样硬化。
• Methods and compositions of novel triazine compounds
  申请人：Timmer T. Richard

  公开号：US20070004729A1

  公开（公告）日：2007-01-04

  The present invention relates to methods and compositions comprising compounds that treat pathophysiological conditions arising from inflammatory responses. In particular, the present invention is directed to compounds that inhibit or block glycated protein produced induction of the signaling-associated inflammatory response in endothelial cells. The present invention relates to compounds that inhibit smooth muscle proliferation. In particular, the present invention is directed to compounds that inhibit smooth muscle cell proliferation by modulating HSPGs such as Perlecan. The present invention further relates to the use of compounds to treat vascular occlusive conditions characterized by smooth muscle proliferation such as restenosis and atherosclerosis.

  本发明涉及治疗由炎症反应引起的病理生理状况的方法和组合物。特别地，本发明涉及抑制或阻断糖化蛋白诱导内皮细胞信号相关炎症反应的化合物。本发明涉及抑制平滑肌增殖的化合物。特别地，本发明涉及通过调节HSPGs如Perlecan来抑制平滑肌细胞增殖的化合物。本发明进一步涉及使用化合物治疗以平滑肌增殖为特征的血管闭塞性疾病，如再狭窄和动脉粥样硬化。
• Guanamines in textile finishing
  申请人：AMERICAN CYANAMID CO

  公开号：US02385766A1

  公开（公告）日：1945-09-25
• DE731309
  申请人：——

  公开号：——

  公开（公告）日：——