Photosensitive compositions and applications thereof
申请人:PROMERUS, LLC
公开号:US11537045B2
公开(公告)日:2022-12-27
The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo-oxidative chain degradation and exhibit improved mechanical properties.
PHOTOSENSITIVE DIELECTRIC RESIN COMPOSITIONS AND THEIR USES
申请人:Promerus, LLC
公开号:EP1778759A1
公开(公告)日:2007-05-02
Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films
申请人:Amoroso Dino
公开号:US20060008734A1
公开(公告)日:2006-01-12
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
Thermo-oxidatively Stable, Side Chain Polyether Functionalized Polynorbornenes for Microelectronic and Optoelectronic Devices and Assemblies Thereof
申请人:PROMERUS, LLC
公开号:US20160319060A1
公开(公告)日:2016-11-03
The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized where such the PNBs of such compositions and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.
PHOTOSENSITIVE COMPOSITIONS AND APPLICATIONS THEREOF
申请人:PROMERUS, LLC
公开号:US20210116807A1
公开(公告)日:2021-04-22
The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo-oxidative chain degradation and exhibit improved mechanical properties.