2-Hydroxy-hexan-1-sulfonsaeure

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 有机磺酸及其衍生物
• 英文名称: 2-Hydroxy-hexan-1-sulfonsaeure
• 英文别名: 2-hydroxy-hexane-1-sulfonic acid；β-hydroxyhexanesulfonic acid；2-Hydroxyhexane-1-sulfonic acid
• 化学式: C₆H₁₄O₄S
• 分子量: 182.241
• InChiKey: CZFRHHAIWDBFCI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.3
• 重原子数：
  11
• 可旋转键数：
  5
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  83
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  1-己烯 在 dioxane-sulfur trioxide 、 1,2-二氯乙烷 作用下， 生成 2-Hydroxy-hexan-1-sulfonsaeure
  参考文献：
  名称：

  Sulfonation of Olefins. IV. A δ-Sultone from Styrene

  摘要：

  DOI：

  10.1021/ja01644a025

文献信息

• ACID-ADDITION SALT OF Trk-INHIBITING COMPOUND
  申请人：ONO PHARMACEUTICAL CO., LTD.

  公开号：US20170240527A1

  公开（公告）日：2017-08-24

  In order to provide a prophylactic and/or therapeutic agent for Trk-related diseases, the present invention provides a compound which has a selective Trk-inhibiting activity and persistently inhibits NGF vascular hyper permeability and does not have a drug interaction and in addition thereto, is excellent in solubility and absorbability against free bases. The compound of the present invention has a selective Trk-inhibiting activity and persistently inhibits NGF vascular hyper permeability and does not have a drug interaction and is excellent in solubility and absorbability against free bases, and is therefore useful as a prophylactic and/or therapeutic agent for Trk-related diseases.

  为了为Trk相关疾病提供一种预防和/或治疗剂，本发明提供了一种具有选择性Trk抑制活性的化合物，持续抑制NGF血管高渗透性，并且不具有药物相互作用，此外，该化合物在溶解性和对游离碱的吸收性方面表现出色。本发明的化合物具有选择性Trk抑制活性，持续抑制NGF血管高渗透性，不具有药物相互作用，在溶解性和对游离碱的吸收性方面表现出色，因此可作为Trk相关疾病的预防和/或治疗剂。
• Multilayer circuit boards and processes of making the same
  申请人：MCGEAN-ROHCO, INC.

  公开号：EP0804060A1

  公开（公告）日：1997-10-29

  This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected from the group consisting of tin, bismuth, lead, indium, gallium, germanium, and alloys of said metals, wherein the metal is deposited on the copper circuitry by using an aqueous electroless plating solution. An organosilane bonding mixture is applied between the metal oxide/hydroxide layer and the polymeric dielectric layer.

  本发明涉及一种提高铜电路与介电层粘合力的工艺和一种形成多层印刷电路板的方法，其中电路板的铜电路上覆盖有一层选自锡、铋、铅、铟、镓、锗和上述金属合金的金属氧化物、氢氧化物或其组合的氧化物层，金属是通过使用无电解电镀水溶液沉积在铜电路上的。在金属氧化物/氢氧化物层和聚合电介质层之间使用有机硅烷键合混合物。
• Solder precipitating composition and solder precipitation method
  申请人：Harima Chemicals, Inc.

  公开号：EP1342726A1

  公开（公告）日：2003-09-10

  Lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.

  无铅焊料析出组合物，包括锡粉、银离子和/或铜离子与芳基膦、烷基膦、膦或唑的复合物。析出焊料组合物可以在电路板上形成适当的无铅焊料，而不会在电路板上形成银和/或铜膜。
• PLATING SOLUTION USING PHOSPHONIUM SALT
  申请人：Mitsubishi Materials Corporation

  公开号：EP3276045A1

  公开（公告）日：2018-01-31

  A plating solution including (A) a soluble salt containing at least a stannous salt; (B) an acid selected from organic acid and inorganic acid or a salt thereof; and (C) an additive containing phosphonium salt with two or more of aromatic rings is provided.

  提供了一种电镀液，其中包括：(A) 至少含有亚锡盐的可溶性盐；(B) 选自有机酸和无机酸的酸或其盐；以及 (C) 含有两个或两个以上芳香环的鏻盐的添加剂。
• Plating solution using phosphonium salt
  申请人：MITSUBISHI MATERIALS CORPORATION

  公开号：US10174434B2

  公开（公告）日：2019-01-08

  A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing phosphonium salt with two or more of aromatic rings is provided.

  本发明提供了一种电镀液，其中包括至少含有亚锡盐的可溶性盐、选自有机酸和无机酸的酸或其盐、以及含有两个或两个以上芳香环的鏻盐的添加剂。