Ethyl 7-[3-(4-fluorophenyl)-2-phenyl-5-propan-2-ylimidazol-4-yl]-5-hydroxy-3-oxohept-6-enoate

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: Ethyl 7-[3-(4-fluorophenyl)-2-phenyl-5-propan-2-ylimidazol-4-yl]-5-hydroxy-3-oxohept-6-enoate
• 化学式: C₂₇H₂₉FN₂O₄
• 分子量: 464.5
• InChiKey: DAKSKMZHQSLQEF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.5
• 重原子数：
  34
• 可旋转键数：
  11
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.3
• 拓扑面积：
  81.4
• 氢给体数：
  1
• 氢受体数：
  6

文献信息

• Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
  申请人：BREWER SCIENCE, INC.

  公开号：US20030054117A1

  公开（公告）日：2003-03-20

  An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 &mgr;m or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.

  本发明提供了一种改进的方法，可将聚合物抗反射涂层应用于基底表面及由此产生的前驱体结构。概括地说，该方法包括在基底表面进行等离子体增强化学气相沉积（PECVD）聚合物。最优选的起始单体是 4-氟苯乙烯、2,3,4,5,6-五氟苯乙烯和烯丙基五氟苯。PECVD 工艺包括将单体置于足够的电流和压力下，使单体升华形成蒸汽，然后通过施加电流将蒸汽转变为等离子状态。气化的单体随后在沉积室中聚合到基底表面上。本发明的方法适用于在具有超亚微米（0.25 微米或更小）特征的大表面基底上提供高保形防反射涂层。与传统的化学气相沉积（CVD）方法相比，该工艺的沉积速率快得多，而且环保、经济。
• EP1397260A4
  申请人：——

  公开号：EP1397260A4

  公开（公告）日：2006-03-08
• POLYMERIC ANTIREFLECTIVE COATINGS DEPOSITED BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION
  申请人：Brewer Science, Inc.

  公开号：EP1397260A1

  公开（公告）日：2004-03-17
• [EN] POLYMERIC ANTIREFLECTIVE COATINGS DEPOSITED BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION<br/>[FR] REVETEMENTS POLYMERES ANTIREFLET DEPOSES PAR DEPOT CHIMIQUE EN PHASE VAPEUR ASSISTE PAR PLASMA
  申请人：BREWER SCIENCE INC

  公开号：WO2002062593A1

  公开（公告）日：2002-08-15

  An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene,2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 νm or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.
• [EN] POLYMERIC ANTIREFLECTIVE COATINGS DEPOSITED BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION<br/>[FR] REVETEMENTS ANTIREFLECHISSANTS POLYMERES DEPOSES PAR DEPOT CHIMIQUE EN PHASE VAPEUR A PLASMA AMELIORE
  申请人：BREWER SCIENCE INC

  公开号：WO2003087233A2

  公开（公告）日：2003-10-23

  An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 µm or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.