[EN] COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A POLYAMINOAMIDE TYPE LEVELING AGENT<br/>[FR] COMPOSITION D'ÉLECTRODÉPOSITION DE BOSSE DE CUIVRE COMPRENANT UN AGENT NIVELANT DE TYPE POLYAMINOAMIDE
申请人:BASF SE
公开号:WO2021197950A1
公开(公告)日:2021-10-07
The present invention provides a composition comprising copper ions, an acid, and at least one polyaminoamide comprising, a group of formula (L1) [A-B-A'-Z]n[Y-Z]m (L1) wherein B is a diacid fragment of formula (L2) A, A' are amine fragments independently selected from formula (L3a) or of Formula (L3b) Y is a co-monomer fragment; Z is a coupling fragment of formula (L4) n is an integer of from 1 to 400; m is 0 or an integer of from 1 to 400;