N,N,2-三丙基戊酰胺 | 3116-30-1

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 中文名称: N,N,2-三丙基戊酰胺
• 英文名称: 2-Propyl-valeriansaeure-dipropylamid
• 英文别名: Valeramide, N,N,2-tripropyl-；N,N,2-tripropylpentanamide
• CAS: 3116-30-1
• 化学式: C₁₄H₂₉NO
• 分子量: 227.39
• InChiKey: VXOHMBHHIUTXKU-UHFFFAOYSA-N

物化性质

• 沸点：
  279.8±8.0 °C(Predicted)
• 密度：
  0.860±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  4.4
• 重原子数：
  16
• 可旋转键数：
  9
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.93
• 拓扑面积：
  20.3
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  N,N,2-三丙基戊酰胺 生成 Dipropyl-(2-propyl-pentyl)-amine
  参考文献：
  名称：

  Benoit Guyod; Benoit Guyod; Simiand, European Journal of Medicinal Chemistry, 1974, vol. 9, # 2, p. 169 - 174

  摘要：

  DOI：
• 作为产物：
  描述：

  丙戊酸 在 氯化亚砜 作用下， 以 苯 为溶剂， 生成 N,N,2-三丙基戊酰胺
  参考文献：
  名称：

  Benoit-Guyod,J.-L. et al., Bulletin de la Societe Chimique de France, 1965, p. 1660 - 1661

  摘要：

  DOI：

文献信息

• Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：EP2907838A1

  公开（公告）日：2015-08-19

  Provided is a method of producing a polyimide resin that produces a polyimide resin excellent in heat resistance and mechanical properties and having a low dielectric constant even when heat-treated at a lower temperature. The method of producing a polyimide resin according to the present invention includes heating at from 120°C to 350°C a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent comprising at least a compound (A) represented by the general formula (1), in which R1 represents a hydrogen atom or a hydroxyl group, R2 and R3 independently represent a hydrogen atom or a C1 to C3 alkyl group, and R4 and R5 independently represent a C1 to C3 alkyl group.

  本发明提供了一种生产聚酰亚胺树脂的方法，该方法可生产出耐热性和机械性能优异的聚酰亚胺树脂，即使在较低温度下进行热处理，其介电常数也很低。根据本发明生产聚酰亚胺树脂的方法包括在 120°C 至 350°C 的温度下加热由四羧酸二酐组分和二胺组分在溶剂中反应生成的聚酰胺，该溶剂至少包含通式（1）代表的化合物（A），其中 R1 代表氢原子或羟基，R2 和 R3 独立地代表氢原子或 C1 至 C3 烷基，R4 和 R5 独立地代表 C1 至 C3 烷基。
• Valproate as a topical anti-fungal treatment
  申请人：Wayne State University

  公开号：US10617659B2

  公开（公告）日：2020-04-14

  Valproate is useful as an antifungal agent. The valproate compositions can be used to treat fungal infections. The valproate compositions can be formulated as topical antifungals.

  丙戊酸钠可用作抗真菌剂。丙戊酸盐组合物可用于治疗真菌感染。丙戊酸盐组合物可配制成局部抗真菌剂。
• VALPROATE AS A TOPICAL ANTI-FUNGAL TREATMENT
  申请人：Wayne State University

  公开号：EP3222324B1

  公开（公告）日：2020-05-13
• METHOD OF PRODUCING POLYIMIDE RESIN, METHOD OF PRODUCING POLYIMIDE COATING, METHOD OF PRODUCING POLYAMIC ACID SOLUTION, POLYIMIDE COATING, AND POLYAMIC ACID SOLUTION
  申请人：Tokyo Ohka Kogyo Co., Ltd.

  公开号：US20150232619A1

  公开（公告）日：2015-08-20

  A method of producing a polyimide resin that produces a polyimide resin having excellent heat resistance and mechanical properties, and having a low dielectric constant even when heat-treated at a lower temperature. The method includes heating at 120° C. to 350° C. a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent including at least a compound represented by the general formula (1), in which R 1 represents a hydrogen atom or a hydroxyl group, R 2 and R 3 independently represent a hydrogen atom or a C 1 to C 3 alkyl group, and R 4 and R 5 independently represent a C 1 to C 3 alkyl group.
• RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20190354018A1

  公开（公告）日：2019-11-21

  A resist underlayer film-forming composition exhibiting high etching resistance, high heat resistance, and excellent coatability; a resist underlayer film obtained using the resist underlayer film-forming composition and a method for producing the same; a method for forming a resist pattern; and a method for producing a semiconductor device. A resist underlayer film-forming composition including a polymer and a compound represented by Formula (1) as a solvent. In Formula (1), R 1 , R 2 , and R 3 in Formula (1) each independently represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, which may be interrupted by an oxygen atom, a sulfur atom, or an amide bond, and R 1 , R 2 , and R 3 may be the same or different and may bond to each other to form a ring structure.