Pelargonsaeure-cyclohexylester | 1551-41-3

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: Pelargonsaeure-cyclohexylester
• 英文别名: nonanoic acid cyclohexyl ester；Nonansaeure-cyclohexylester；Cyclohexyl nonanoate
• CAS: 1551-41-3
• 化学式: C₁₅H₂₈O₂
• 分子量: 240.386
• InChiKey: ZXGCFXPVWOGXMA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.5
• 重原子数：
  17
• 可旋转键数：
  9
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.93
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  壬酰氯 、 环己醇 在 吡啶 作用下， 生成 Pelargonsaeure-cyclohexylester
  参考文献：
  名称：

  The Effect of Molecular Size and Structure on the Pyrolysis of Esters^1,2

  摘要：

  DOI：

  10.1021/ja01561a024

文献信息

• The scope and mechanism of palladium-catalysed Markovnikov alkoxycarbonylation of alkenes
  作者：Haoquan Li、Kaiwu Dong、Haijun Jiao、Helfried Neumann、Ralf Jackstell、Matthias Beller

  DOI：10.1038/nchem.2586

  日期：2016.12

  70 years, numerous catalyst systems have been developed that allow for highly linear-selective (anti-Markovnikov) reactions and are used in industry to produce linear carboxylates starting from olefins. In contrast, a general catalyst system for Markovnikov-selective alkoxycarbonylation of aliphatic olefins remains unknown. In this paper, we show that a specific palladium catalyst system consisting

  加氢酯化反应代表了羰基化反应的基本类型，并且构成了均相催化的最重要的工业应用之一。在过去的70年中，已经开发了许多催化剂系统，这些系统可以进行高度线性选择（反马氏力）反应，并在工业上用于从烯烃开始生产线性羧酸盐。相比之下，用于脂族烯烃的马尔科夫尼科夫选择性烷氧基羰基化的一般催化剂体系仍然是未知的。在本文中，我们显示了由PdX 2 / N组成的特定钯催化剂体系-苯基吡咯膦（X，卤化物）催化各种烯烃的烷氧基羰基化，以高选择性（支链选择性高达91％）得到支链酯。观察到的（和意想不到的）选择性已经通过包括色散校正在内的密度泛函理论计算得到了合理化。
• ASSEMBLY AND SEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3348336A1

  公开（公告）日：2018-07-18

  Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.

  本文提供了一种连接体，包括：第一构件；第二构件；以及连接第一构件和第二构件的烧结金属层。烧结金属层包括由片状铜颗粒形成的结构，这些铜颗粒的方向大致平行于第一构件或第二构件与烧结金属层之间的界面，烧结金属层中所含的铜量占烧结金属层体积的 65% 或更多。
• Assembly and semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US10566304B2

  公开（公告）日：2020-02-18

  Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.

  本文提供了一种连接体，包括：第一构件；第二构件；以及连接第一构件和第二构件的烧结金属层。烧结金属层包括由片状铜颗粒形成的结构，这些铜颗粒的方向大致平行于第一构件或第二构件与烧结金属层之间的界面，烧结金属层中所含的铜量占烧结金属层体积的 65% 或更多。
• Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US10748865B2

  公开（公告）日：2020-08-18

  Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 μm or more and 0.8 μm or less and micro copper particles having a volume-average particle diameter of 2 μm or more and 50 μm or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.

  本发明提供了一种用于连接的铜浆，包括铜颗粒、包括铜以外的金属元素的第二颗粒和分散介质，其中铜颗粒包括体积-平均颗粒直径大于或等于 0.12 μm 且小于或等于 0.12 μm 的亚微型铜颗粒，以及体积-平均颗粒直径大于或等于 2 μm 且小于或等于 50 μm 的微型铜颗粒。8 μm 或更小的亚微米铜颗粒和体积平均颗粒直径为 2 μm 或更大且小于 50 μm 的微米铜颗粒，亚微米铜颗粒的含量和微米铜颗粒的含量之和为铜颗粒和第二颗粒质量之和的 80% 或更多，亚微米铜颗粒的含量为亚微米铜颗粒质量和微米铜颗粒质量之和的 30% 或更多且 90% 或更少，第二颗粒的含量为 0.01% （以质量计）或以上，10% （以质量计）或以下。
• JOINED BODY AND SEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3348336B1

  公开（公告）日：2020-05-13