[EN] ANTIBODY DRUG CONJUGATES (ADCS) WITH NAMPT INHIBITORS<br/>[FR] CONJUGUÉS ANTICORPS-MÉDICAMENT (ADC) AVEC DES INHIBITEURS DE NAMPT
申请人:BAYER PHARMA AG
公开号:WO2021013693A1
公开(公告)日:2021-01-28
Conjugate of a binder having formula (AA) wherein AB stands for a binder, Z' stands for a linker, D stands for an active component which is a NAMPT inhibitor and its use as pharmaceuticals.
Polyether polyol dendron conjugates with effector molecules for biological targeting
申请人:mivenion GmbH
公开号:EP2100621A1
公开(公告)日:2009-09-16
Subject of the present invention are polyether polyol dendron conjugates comprising a specific polyether polyol dendron moiety, at least one certain fluorescent effector molecule (E). Such polyether polyol dendron conjugates may be used for diagnostic and therapeutic purposes, whereby the optical properties of the at least one certain fluorescent effector molecule are enhanced due to the attachment to the polyether polyol dendron conjugate.
Novel copolymers and superoxide dismutase modified with said copolymers
申请人:KURARAY CO., LTD.
公开号:EP0314042A2
公开(公告)日:1989-05-03
Described are copolymers comprising the copolymer-constituting units characterized in the claims and having an average molecular weight of 400 to 20,000. Furthermore superoxide dismutase (SOD) derivatives are described which can be obtained by modification with the above copolymers and have a single chemical structure, retain most of the enzymatic activity of SOD and exhibit a much prolonged plasma half-life. Therefore, they are useful as medicinal chemicals.
SEMICONDUCTOR SENSOR AND MANUFACTURING METHOD FOR SAME, AND COMPOUND SENSOR
申请人:Toray Industries, Inc.
公开号:EP3531131A1
公开(公告)日:2019-08-28
In order to selectively detect a target substance in high sensitivity, a semiconductor sensor includes a substrate, a first electrode, a second electrode, and a semiconductor layer located between the first electrode and the second electrode, in which the semiconductor layer includes a semiconducting component and a substructure of immunoglobulin, and the substructure of immunoglobulin is bonded or attached to the semiconducting component through a linking group L1 in a hinge region of a heavy chain. Moreover, a method for producing a semiconductor sensor includes a step of forming the semiconductor layer, the step including a step of applying a semiconducting component between the first electrode and the second electrode.