2.4-Dimethyl-3-sulfolen | 89599-33-7

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 二氢噻吩类
• 英文名称: 2.4-Dimethyl-3-sulfolen
• 英文别名: 2,5-dimethyl-2,5-dihydro-thiophene-1,1-dioxide；2,5-Dimethyl-2,5-dihydro-thiophen-1,1-dioxid；2,5-Dimethyl-2,5-dihydrothiophene 1,1-dioxide
• CAS: 89599-33-7
• 化学式: C₆H₁₀O₂S
• 分子量: 146.21
• InChiKey: MDIIFXJFUPEKHP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.6
• 重原子数：
  9
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  42.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  3-环丁烯砜 、 碘甲烷 在 六甲基磷酰三胺 、 lithium hexamethyldisilazane 作用下， 以 四氢呋喃 为溶剂， 反应 2.0h， 以83%的产率得到2.4-Dimethyl-3-sulfolen
  参考文献：
  名称：

  Chou, Ta-shue; Chang, Lee-Jean; Tso, Hsi-Hwa, Journal of the Chemical Society. Perkin transactions I, 1986, p. 1039 - 1042

  摘要：

  DOI：

文献信息

• METHOD FOR MANUFACTURING SULFOLENE COMPOUND AND METHOD FOR MANUFACTURING SULFOLANE COMPOUND
  申请人：Sumitomo Seika Chemicals Co., Ltd.

  公开号：EP2368888B1

  公开（公告）日：2014-03-26
• CHOU TA-SHUE; CHANG LEE-JEAN; TSO HSI-HWA, J. CHEM. SOC. PERKIN TRANS.,(1986) N 6, 1039-1042
  作者：CHOU TA-SHUE、 CHANG LEE-JEAN、 TSO HSI-HWA

  DOI：——

  日期：——
• CHOU, TA-SHUE;YU, CHIN-FEN, J. CHIN. CHEM. SOC., 34,(1987) N 3, 211-217
  作者：CHOU, TA-SHUE、YU, CHIN-FEN

  DOI：——

  日期：——
• B-STAGEABLE DIE ATTACH ADHESIVES
  申请人：Forray Deborah Derfelt

  公开号：US20080160315A1

  公开（公告）日：2008-07-03

  The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
• LOW TEMPERATURE CURING COMPOSITIONS
  申请人：Bai Jie

  公开号：US20110133330A1

  公开（公告）日：2011-06-09

  The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal/carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100° C., for instance 55-70° C., over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.