The present invention is a positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that enable formation of a fine pattern and high resolution, have excellent mechanical characteristics even when cured at low temperatures, and have no degradation in adhesive force between before and after a high temperature and high humidity test.
本发明是一种正性光敏
树脂组合物,包括(A)一种碱溶性
树脂,含有至少一种或多种选自聚
酰亚胺结构、聚
苯并恶唑结构、聚酰胺-
酰亚胺结构及其前体结构的结构;(B)一种可交联聚合物化合物,含有由下式(1)表示的结构单元,并具有与组分(A)交联的基团;以及(C)一种具有喹酮
噻嗪结构的化合物,用作光敏剂,通过光产生酸,并提高对碱性
水溶液的溶解速度。本发明的目的是提供一种正感光
树脂组合物和一种正感光干膜,这种组合物和干膜能形成精细的图案和高分辨率,即使在低温下固化也具有优良的机械特性,而且在高温高湿试验前后粘合力不会下降。