申请人:SUMITOMO BAKELITE CO., LTD.
公开号:US10224259B2
公开(公告)日:2019-03-05
The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler.
In the general formulae (1), (2-1) and (2-2), each of X2, X3 and X4 independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula “—SO2—” or “—CO—”, an oxygen atom or a single bond.
根据本发明的用于密封半导体的树脂组合物,其特征在于含有由以下通式(1)表示的马来酰亚胺基化合物、由以下通式(2-1)和以下通式(2-2)表示的苯并恶嗪基化合物中的至少一种、固化催化剂和无机填料。
在通式(1)、(2-1)和(2-2)中,X2、X3 和 X4 各自独立地代表具有 1 至 10 个碳原子的亚烷基、下 列通式(3)所代表的基团、式"-SO2-"或"-CO-"所代表的基团、氧原子或单键。