1-(2',5'-dihydroxyphenyl)-2-hydroxynaphthalene | 147609-02-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1-(2',5'-dihydroxyphenyl)-2-hydroxynaphthalene
• 英文别名: 2-(2-Hydroxynaphthalen-1-yl)benzene-1,4-diol
• CAS: 147609-02-7
• 化学式: C₁₆H₁₂O₃
• 分子量: 252.269
• InChiKey: CCQIRWRPHINPAO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  19
• 可旋转键数：
  1
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  60.7
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  1-(2',5'-dihydroxyphenyl)-2-hydroxynaphthalene 在 zeolite HSZ-360 作用下， 以 various solvent(s) 为溶剂， 反应 5.0h， 以77%的产率得到10-Hydroxybenzonaphtho<1,2-d>furan
  参考文献：
  名称：

  Arienti, Attilio; Bigi, Franca; Maggi, Raimondo, Journal of the Chemical Society. Perkin transactions I, 1997, # 9, p. 1391 - 1393

  摘要：

  DOI：
• 作为产物：
  描述：

  、 对苯醌 在 三氯化铝 作用下， 以 二硫化碳 为溶剂， 反应 4.0h， 以60%的产率得到1-(2',5'-dihydroxyphenyl)-2-hydroxynaphthalene
  参考文献：
  名称：

  Sartori, Giovanni; Maggi, Raimondo; Bigi, Franca, Journal of the Chemical Society. Perkin transactions I, 1993, # 1, p. 39 - 42

  摘要：

  DOI：

文献信息

• Quinine-Catalyzed Asymmetric Synthesis of 2,2′-Binaphthol-Type Biaryls under Mild Reaction Conditions
  作者：Mauro Moliterno、Riccardo Cari、Antonio Puglisi、Achille Antenucci、Céline Sperandio、Erica Moretti、Antonio Di Sabato、Riccardo Salvio、Marco Bella

  DOI：10.1002/anie.201601660

  日期：2016.5.23

  Simple quinine as an organocatalyst mediates the addition of various naphthols to halogenated quinones to afford non‐C2‐symmetrical, axially chiral biaryl products, which are promising compounds as chiral ligands and organocatalysts. The rotational barrier required to have two distinct atropisomers has been evaluated in the products generated from the addition of naphthols to various quinones by means

  简单的奎宁作为有机催化剂可介导将各种萘酚添加到卤代醌中，以提供非C 2对称的轴向手性联芳基产品，这些化合物有望用作手性配体和有机催化剂。已通过DFT计算和HPLC在将萘酚添加到各种醌中生成的产物中评估了具有两种不同的阻转异构体所需的旋转势垒。必须使用卤代醌作为试剂，以得到结构稳定的对映体产物，该产物可以良好的收率和立体选择性获得。这些化合物也已以克量制备，并重结晶至接近对映体纯度。
• COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD
  申请人：DIC CORPORATION

  公开号：US20160122269A1

  公开（公告）日：2016-05-05

  There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.