DUBS P.; STUESSI R., HELV. CHIM. ACTA, 1978 61, NO 7, 2351-2359
作者:DUBS P.、 STUESSI R.
DOI:——
日期:——
LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
申请人:ASANO Masatoshi
公开号:US20080265438A1
公开(公告)日:2008-10-30
A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, (D) a hygroscopic agent, and optionally, (E) a fluxing agent has the advantages of void-free fill, shelf stability and solder connection, and is thus advantageously used in the fabrication of flip chip semiconductor devices by the no-flow method.
Investigation of the Head-Space of Roasted Meat II. Synthesis of substituted 2, 4, 5-trithia-hexanes
作者:Paul Dubs、Rita Stüssi
DOI:10.1002/hlca.19780610708
日期:1978.11.1
Substituted2, 4, 5-trithiahexanes 1, a class of substances recently found in roasted meat, have been synthesized via two different routes.