An adhesive composition useful in bonding a protective glass with a silicon substrate of a semiconductor device contains (A) an epoxy-containing high-molecular compound and (B) a solvent. The compound (A) has a weight average molecular weight of 3,000 to 500,000 and repeating units represented by the following formula (1):
wherein R1 to R4 each represent a monovalent hydrocarbon group, m is 1 to 100, a, b, c and d indicate ratios of respective repeating units based on a number of all repeating units and each stand for 0 or a positive number with a proviso that c and d are not 0 at the same time and 0 < (c+d)/(a+b+c+d) ≤ 1.0 is satisfied, and X and Y are phenolic hydroxyl-containing, divalent aromatic groups.
一种用于粘接保护
玻璃和半导体器件
硅基板的粘合剂组合物含有(A)一种含环氧
树脂的高分子化合物和(B)一种溶剂。化合物(A)的重量平均分子量为 3,000 至 500,000,重复单元由下式(1)表示:
其中 R1 至 R4 各自代表一价烃基,m 为 1 至 100,a、b、c 和 d 表示各自重复单元在所有重复单元数目基础上的比率,各自代表 0 或正数,但条件是 c 和 d 不能同时为 0,且满足 0 < (c+d)/(a+b+c+d) ≤ 1.0,X 和 Y 为含
酚羟基的二价芳香基团。