申请人:Dai Lenore
公开号:US11034791B2
公开(公告)日:2021-06-15
Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.
提供了包括热固性聚合物网络和与热固性聚合物网络共价键合的机械体的组合物。还提供了包括该组合物的基底。此外,还提供了制造该组合物的方法和监测包含该组合物的基底上的应力的方法。