COMPOSITION FOR WATER-REPELLENT TREATMENT OF SURFACE, AND METHOD FOR WATER-REPELLENT TREATMENT OF SURFACE OF SEMICONDUCTOR SUBSTRATE USING SAME
申请人:Wako Pure Chemical Industries, Ltd.
公开号:EP2615633A1
公开(公告)日:2013-07-17
The purpose of the present invention to provide: a composition which can be used for water-repellent treating of the entire surface of a semiconductor substrate having a pattern formed by laminating a Si-containing insulating layer and a metal layer, at one time; and a method for water-repellent treatment of the semiconductor substrate surface using the composition.
The present invention relates to: (1) a composition for water-repellent treatment of a semiconductor substrate surface comprising a) at least one kind of a compound selected from the group consisting of a long-chain alkyl tertiary amine and a long-chain alkyl ammonium salt, b) a base or an acid generating agent, having a condensed ring structure or forming a condensed ring structure by generating a base or an acid and c) a polar organic solvent, and (2) a method for water-repellent treatment of the semiconductor substrate surface having the pattern formed by laminating the Si-containing insulating layer and the metal layer, using the composition.
本发明的目的是:提供一种组合物,该组合物可用于一次性对具有通过层叠含硅绝缘层和金属层而形成的图案的半导体衬底的整个表面进行憎水处理;以及一种使用该组合物对半导体衬底表面进行憎水处理的方法。
本发明涉及(1) 一种用于对半导体衬底表面进行憎水处理的组合物,该组合物包含 a) 至少一种选自由长链烷基叔胺和长链烷基铵盐组成的组的化合物;b) 碱或酸生成剂、(2) 使用该组合物对具有通过层压含硅绝缘层和金属层而形成的图案的半导体衬底表面进行憎水处理的方法。