In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
在一种实施例中,本申请公开了一种具有
化学式I和
化学式II的光解离表面结合化合物:其中变量
EG、
EG1、
SP1、
SP2、
SP3、Ar和BG的定义如本文所述。在另一种实施例中,该申请公开了一种利用该表面结合化合物在基板表面形成涂层的方法。