Electronic device substrate, method for manufacturing substrate
申请人:Seiko Epson Corporation
公开号:EP1854553B1
公开(公告)日:2014-11-05
ELECTRONIC DEVICE SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, COMPOUND USED FOR SUBSTRATE, METHOD FOR MANUFACTURING COMPOUND AND POLYMERIZATION INITIATOR INCLUDING COMPOUND
申请人:FUKUSHIMA Hitoshi
公开号:US20070259187A1
公开(公告)日:2007-11-08
An electronic device substrate includes a substrate having at least one of a metal and a metal oxide on a surface thereof and an underlying layer having a compound expressed by a following general formula (1):
wherein X presents one of a hydrogen atom and a protecting group; Y
1
represents one of an oxygen atom, an alkylene group and —N(R
1
)—, in which R
1
represents an alkyl group; Z
1
represents a polymerization initiating group; n
1
represents an integer from 1 to 4; and m
1
represents an integer from 1 to 15.
US7955705B2
申请人:——
公开号:US7955705B2
公开(公告)日:2011-06-07
Lewina et al., Zhurnal Obshchei Khimii, 1952, vol. 22, p. 430,433,434;engl.Ausg.S.497