Synthesis Optimization, Scale-Up, and Catalyst Screening Efforts toward the MGAT2 Clinical Candidate, BMS-963272
作者:James Kempson、Xiaoping Hou、Jung-Hui Sun、Michael Wong、Joseph Pawluczyk、Jianqing Li、Subramaniam Krishnananthan、Eric M. Simmons、Yi Hsiao、Yi-Xin Li、Dawn Sun、Dauh-Rurng Wu、Wei Meng、Saleem Ahmad、Lidet Negash、Robert Brigance、Huji Turdi、Jon J. Hangeland、R. Michael Lawrence、Pratik Devasthale、Jeffrey A. Robl、Arvind Mathur
DOI:10.1021/acs.oprd.2c00036
日期:2022.4.15
This paper describes the efficient scale-up synthesis of 1 (BMS-963272) which relies upon a highly selective Mannich-type alkylation strategy to stereospecifically install a quaternary carbon center. An intramolecular cyclization reaction is also used to form the aryl dihydropyridone (ADHP) core. The optimized route has been demonstrated to provide more than 100 g of active pharmaceutical ingredient
Synthesis of 2-(Tetrazolylacetyl)cyclohexane-1,3-diones
作者:T. S. Khlebnicova、V. G. Zinovich、Yu. A. Piven、A. V. Baranovsky、F. A. Lakhvich、R. E. Trifonov
DOI:10.1134/s1070363221080028
日期:2021.8
Aqueous polishing liquid and chemical mechanical polishing method
申请人:Kato Tomo
公开号:US20070069176A1
公开(公告)日:2007-03-29
An aqueous polishing liquid is provided that includes an oxidizing agent, a five-membered monocyclic compound having at least three nitrogen atoms or a compound in which a hetero ring is fused to said compound, and a compound having an imidazole skeleton or an isothiazolin-3-one skeleton. The five-membered monocyclic compound having at least three nitrogen atoms and/or the compound in which a hetero ring is fused to said compound is used at a total concentration of less than 300 mg/L, and the compound having an imidazole skeleton or an isothiazolin-3-one skeleton is used at a concentration of at least 10 mg/L but no greater than 500 mg/L. There is also provided a chemical mechanical polishing method that includes a step of polishing by making a surface to be polished and a polishing surface move relative to each other while being in contact with each other in the presence of the aqueous polishing liquid.
Metal-polishing liquid and chemical mechanical polishing method using the same
申请人:Yamashita Katsuhiro
公开号:US20070186484A1
公开(公告)日:2007-08-16
The invention provides a metal polishing liquid comprising an oxidizing agent and colloidal silica in which a part of a surface of the colloidal silica is covered with aluminum atoms, and a Chemical Mechanical Polishing method using the same. An amino acid, a compound having an isothiazoline-3-one skeleton, an organic acid, a passivated film forming agent, a cationic surfactant, a nonionic surfactant, and a water-soluble polymer may be contained. A metal polishing liquid which is used in Chemical Mechanical Polishing in manufacturing of a semiconductor device, attains low dishing of a subject to be polished, and can perform polishing excellent in in-plane uniformity of a surface to be polished.
POLISHING COMPOSITION AND METHOD OF POLISHING WITH THE SAME
申请人:Takenouchi Kenji
公开号:US20070287362A1
公开(公告)日:2007-12-13
A polishing composition comprises: at least one compound selected from tetrazole compounds and derivatives thereof and anthranilic acid compounds and derivatives thereof; abrasive particles comprising associative abrasive particles; and an oxidizing agent.