申请人:Huntsman International LLC
公开号:US20180171101A1
公开(公告)日:2018-06-21
A composition comprising
(a) a cationically polymerisable epoxy resin,
(b) an initiator for the cationic polymerisation,
(c) a microparticle filler, and
(d) a nanoparticle filler
can be used for the production of thermally stable insulating material for electrical and electronic components.