Metal Complexes for Chemical Vapour Deposition of Platinum
申请人:Doppelt Pascal
公开号:US20110294672A1
公开(公告)日:2011-12-01
The invention relates to platinum complexes, to a method for preparing the same and to the use thereof for the chemical vapour deposition of metal platinum. The chemical vapour deposition of platinum onto a substrate is made from a platinum organometallic compound that includes a ligand with a cyclic structure including at least two non-adjacent C═C double bonds, and the platinum organometallic compound has a square-plane structure in which the platinum is bonded to each of the C═C double bonds of the ligand, thereby forming a (C═C)—Pt—(C═C) of 60° to 70°.