1-(N,N-dimethylamino)-3-phenoxy-2-propanol | 21234-17-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: 1-(N,N-dimethylamino)-3-phenoxy-2-propanol
• 英文别名: 1-dimethylamino-3-phenoxy-propan-2-ol；(β-Oxy-γ-dimethylamino-propyl)-phenyl-aether；β-Phenoxy-β'-dimethylamino-isopropylalkohol；Dimethyl-(β-oxy-γ-phenoxy-propyl)-amin；Cambridge id 5135827；1-(dimethylamino)-3-phenoxypropan-2-ol
• CAS: 21234-17-3
• 化学式: C₁₁H₁₇NO₂
• mdl: MFCD00464543
• 分子量: 195.261
• InChiKey: IMJCKVKBXYZZGJ-UHFFFAOYSA-N

物化性质

• 沸点：
  313.5±27.0 °C(Predicted)
• 密度：
  1.057±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.9
• 重原子数：
  14
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.454
• 拓扑面积：
  32.7
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  溴乙烷 、 1-(N,N-dimethylamino)-3-phenoxy-2-propanol 生成 ethyl-(2-hydroxy-3-phenoxy-propyl)-dimethyl-ammonium; bromide
  参考文献：
  名称：

  Fourneau, Chemisches Zentralblatt, 1910, vol. 81, # I, p. 1134

  摘要：

  DOI：
• 作为产物：
  描述：

  苯酚 在 sodium hydroxide 、 苯 作用下， 生成 1-(N,N-dimethylamino)-3-phenoxy-2-propanol
  参考文献：
  名称：

  Fourneau, Chemisches Zentralblatt, 1910, vol. 81, # I, p. 1134

  摘要：

  DOI：

文献信息

• THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS
  申请人：SHIKOKU CHEMICALS CORPORATION

  公开号：US20200369606A1

  公开（公告）日：2020-11-26

  The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

  本发明的目的是提供：新型硫醇化合物；合成该硫醇化合物的方法；含有该硫醇化合物的固化剂；含有该硫醇化合物和环氧化合物的树脂组合物；以及含有该硫醇化合物和分子中含有碳碳双键的烯烃化合物的树脂组合物。此外，本发明的目的是提供将这些树脂组合物作为成分的粘合剂和密封剂。本发明的硫醇化合物由化学式(I)到化学式(VII)表示。
• MERCAPTOALKYLGLYCOLURILS AND USE OF SAME
  申请人：SHIKOKU CHEMICALS CORPORATION

  公开号：US20160289237A1

  公开（公告）日：2016-10-06

  The invention provides a mercaptoalkylglycoluril represented by the general formula (I): wherein R 1 and R 2 each independently represent a hydrogen atom, a lower alkyl group, or a phenyl group; R 3 , R 4 , and R 5 each independently represent a hydrogen atom or a mercaptoalkyl group selected from a mercaptomethyl group, a 2-mercaptoethyl group, and a 3-mercaptopropyl group; and n is 0, 1, or 2. The invention further provides an epoxy resin composition comprising an epoxy resin and the mercaptoalkylglycoluril, and a method for producing a laminate or a multilayer printed circuit board using the same.

  本发明提供一种由通式（I）表示的巯基烷基脲，其中R1和R2各自独立地表示氢原子、低碳基或苯基；R3、R4和R5各自独立地表示氢原子或从巯基甲基、2-巯基乙基和3-巯基丙基中选择的巯基烷基；n为0、1或2。本发明还提供一种包括环氧树脂和巯基烷基脲的环氧树脂组合物，以及使用该组合物制备层压板或多层印刷电路板的方法。
• LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF
  申请人：Dershem Stephen M.

  公开号：US20100063184A1

  公开（公告）日：2010-03-11

  The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.

  本发明基于发现，某些电子贫乏的烯烃与亲核试剂和碱催化剂结合后，可用作电子封装行业的粘合剂组合物。特别地，本发明中所述的粘合剂配方可用作低温固化配方，对各种基底具有高粘附力。发明配方通常在约80°C下固化，并具有约24小时的搅拌寿命。该配方通过众所周知的Michael加成反应固化。
• MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF
  申请人：SHIKOKU CHEMICALS CORPORATION

  公开号：US20180051038A1

  公开（公告）日：2018-02-22

  The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.

  本发明提供了一种新型的巯基乙基葫芦脲化合物。本发明还提供了一种使用该物质的环氧树脂固化剂，一种使用环氧树脂固化剂的环氧树脂组合物，以及一种使用环氧树脂组合物的粘合剂和密封剂。
• Latent curing agents for epoxy resins
  申请人：AJINOMOTO CO., INC.

  公开号：EP0104837A2

  公开（公告）日：1984-04-04

  An addition product obtained by reacting (a) a polyfunctional epoxy compound and (b) a compound having at least one functional group of OH group, SH group, COOH group and CONHNH2 group together with a tertiary amino group in the molecule, and an addition product obtained (a), (b) and (c) an organic compound having two or more active hydrogen atoms in the molecule (excluding a compound having an epoxy group or tertiary amino group) are good curing agents for epoxy resin. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resin-based compositions.

  将(a)多官能团环氧化合物和(b)分子中含有至少一个羟基、SH 基、COOH 基和 CONHNH2 基官能团的化合物与分子中的叔氨基反应得到的加成产物，以及将(a)、(b)和(c)分子中含有两个或两个以上活泼氢原子的有机化合物（不包括具有环氧基团或叔氨基的化合物）反应得到的加成产物是环氧树脂的良好固化剂。这些固化剂可用于配制新型可储存的单组分热固化环氧树脂基组合物。