申请人:LORD CORPORATION
公开号:EP0596622A2
公开(公告)日:1994-05-11
A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210°C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature conditions.
一种结构粘合剂组合物,含有环氧化合物、胺固化剂和羟基取代的芳香族化合物,其 pKa 在 5 至 9.7 之间,沸点高于 210°C。使用 pKa 和沸点均在上述范围内的羟基取代芳香族化合物制成的粘合剂组合物具有显著的生坯强度,在粘合和固化过程中下沉最小,并能承受高温条件。