Curable compositions and rapid prototyping process using the same
申请人:——
公开号:US20040077745A1
公开(公告)日:2004-04-22
The present invention provides curable compositions and rapid prototyping processes using the same. In one embodiment, the present compositions include one or more aromatic epoxies and one or more aliphatic epoxies, and, after full cure, exhibit a heat deflection temperature of at least 105° C. and an elongation at break of at least 1.5%.
The invention relates to a viscosity reducible radiation curable composition comprising at least one radiation curable component and a filler, wherein the composition has the properties i) a yield stress value of <1100 Pa, ii) a viscosity (at a shear rate of 1 sec
−1
) between 1 and 1500 Pa·sec, and iii) a filler settling speed less than 0.3 mm/day.