High‐
<i>T</i>
<sub>g</sub>
and low‐dielectric epoxy thermosets based on a propargyl ether‐containing phosphinated benzoxazine
作者:Ching Hsuan Lin、Chu Ming Huang、Tung I. Wong、Hou Chien Chang、Tzong Yuan Juang、Wen Chiung Su
DOI:10.1002/pola.27125
日期:2014.5
mechanism was proposed based on the observation. Benzoxazines (3) and (4) were applied as epoxy curing agents. The microstructure and the structure‐property relationship of the resulting thermosets are discussed. The double‐strand structure in (4)‐cured epoxy thermosets afforded higher crosslinking density, and led to higher thermal properties. In addition, the (4)‐cured epoxy thermosets possess half the
含炔丙基醚的苯并恶嗪(4)由碳酸钾催化的炔丙基溴的亲核取代和含酚OH的苯并恶嗪(3)制备,后者由1-(4-羟基苯)-1-(4-氨基苯基)-1-(6-氧化-6H-苯甲酸酯 <1,2>氧磷膦-6-6基)乙烷(1)通过三步程序进行。通过IR和DSC监测(4)的固化反应。在此基础上提出了反应机理。苯并恶嗪(3)和(4)用作环氧固化剂。讨论了所得热固性塑料的微观结构和结构-性质关系。(4)中的双链结构固化的环氧树脂热固性材料具有更高的交联密度,并具有更高的热性能。此外,(4)固化的环氧树脂热固性材料比(3)固化的环氧树脂热固性材料具有高极性羟基的一半,因此介电常数,耗散因数和吸水率较低。©2014 Wiley Periodicals,Inc. J. Polym。科学,A部分:Polym。化学 2014,52,1359年至1367年