9-anthrylmethyl 1-imidazolylcarboxylate | 372107-99-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 蒽
• 英文名称: 9-anthrylmethyl 1-imidazolylcarboxylate
• 英文别名: Anthracen-9-ylmethyl imidazole-1-carboxylate
• CAS: 372107-99-8
• 化学式: C₁₉H₁₄N₂O₂
• 分子量: 302.332
• InChiKey: QOBQCUNSEGUATN-UHFFFAOYSA-N

物化性质

• 沸点：
  545.0±43.0 °C(Predicted)
• 密度：
  1.24±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  4.3
• 重原子数：
  23
• 可旋转键数：
  3
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  44.1
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  4-羟基哌啶 、 9-anthrylmethyl 1-imidazolylcarboxylate 以 N,N-二甲基甲酰胺 为溶剂， 反应 4.0h， 以89%的产率得到9-anthrylmethyl 1-(4-hydroxypiperidine)carboxylate
  参考文献：
  名称：

  PHOTOBASE GENERATOR

  摘要：

  本发明旨在提供当受长波长光（活性能量射线）照射时易于产生碱的新化合物，包含这些化合物的光碱发生器以及光碱生成方法，本发明涉及由通式[1]表示的化合物，包含这些化合物的光碱发生器以及光碱生成方法：（其中，Ar代表从蒽基团、蒽醌基团和芘基团中选择的具有特定结构的任何基团；R1和R2各自独立地代表氢原子或具有1至10个碳原子的直链、支链或环烷基基团，或表示能够与它们结合的氮原子形成含氮原子的脂环烷基环或含氮原子的芳香环，这些环具有3至8个碳原子，可能有取代基；R3和R4各自独立地代表氢原子，具有1至10个碳原子的直链、支链或非环烷基基团）。

  公开号：

  US20110233048A1
• 作为产物：
  描述：

  9-蒽醇 、 N,N'-羰基二咪唑 以 N,N-二甲基甲酰胺 为溶剂， 反应 1.0h， 以87%的产率得到9-anthrylmethyl 1-imidazolylcarboxylate
  参考文献：
  名称：

  PHOTOBASE GENERATOR

  摘要：

  本发明旨在提供当受长波长光（活性能量射线）照射时易于产生碱的新化合物，包含这些化合物的光碱发生器以及光碱生成方法，本发明涉及由通式[1]表示的化合物，包含这些化合物的光碱发生器以及光碱生成方法：（其中，Ar代表从蒽基团、蒽醌基团和芘基团中选择的具有特定结构的任何基团；R1和R2各自独立地代表氢原子或具有1至10个碳原子的直链、支链或环烷基基团，或表示能够与它们结合的氮原子形成含氮原子的脂环烷基环或含氮原子的芳香环，这些环具有3至8个碳原子，可能有取代基；R3和R4各自独立地代表氢原子，具有1至10个碳原子的直链、支链或非环烷基基团）。

  公开号：

  US20110233048A1

文献信息

• COMPOSITION FOR WATER-REPELLENT TREATMENT OF SURFACE, AND METHOD FOR WATER-REPELLENT TREATMENT OF SURFACE OF SEMICONDUCTOR SUBSTRATE USING SAME
  申请人：Wako Pure Chemical Industries, Ltd.

  公开号：EP2615633A1

  公开（公告）日：2013-07-17

  The purpose of the present invention to provide: a composition which can be used for water-repellent treating of the entire surface of a semiconductor substrate having a pattern formed by laminating a Si-containing insulating layer and a metal layer, at one time; and a method for water-repellent treatment of the semiconductor substrate surface using the composition. The present invention relates to: (1) a composition for water-repellent treatment of a semiconductor substrate surface comprising a) at least one kind of a compound selected from the group consisting of a long-chain alkyl tertiary amine and a long-chain alkyl ammonium salt, b) a base or an acid generating agent, having a condensed ring structure or forming a condensed ring structure by generating a base or an acid and c) a polar organic solvent, and (2) a method for water-repellent treatment of the semiconductor substrate surface having the pattern formed by laminating the Si-containing insulating layer and the metal layer, using the composition.

  本发明的目的是：提供一种组合物，该组合物可用于一次性对具有通过层叠含硅绝缘层和金属层而形成的图案的半导体衬底的整个表面进行憎水处理；以及一种使用该组合物对半导体衬底表面进行憎水处理的方法。 本发明涉及(1) 一种用于对半导体衬底表面进行憎水处理的组合物，该组合物包含 a) 至少一种选自由长链烷基叔胺和长链烷基铵盐组成的组的化合物；b) 碱或酸生成剂、(2) 使用该组合物对具有通过层压含硅绝缘层和金属层而形成的图案的半导体衬底表面进行憎水处理的方法。
• Energy-sensitive resin composition
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US10696845B2

  公开（公告）日：2020-06-30

  An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition includes an imidazole compound, a resin precursor component, and a solvent, the resin precursor component being at least one of a monomer component including a diamine compound, a dicarbonyl compound and/or a tetracarboxylic acid dianhydride; and a precursor polymer having a repeating unit.

  一种能量敏感树脂组合物，使用该组合物，即使在低温下对前体聚合物进行热处理，也能生产出一种薄膜或模塑制品，该薄膜或模塑制品由具有优异耐热性、拉伸伸长率和耐化学性且介电常数较低的含亚胺环聚合物组成，或由具有优异耐热性、拉伸伸长率和耐化学性的含噁唑环聚合物组成。制造薄膜或模塑制品的方法；使用能量敏感树脂组合物形成图案的方法；以及具有优异耐热性、拉伸伸长率和耐化学性的永久性薄膜。能敏树脂组合物包括咪唑化合物、树脂前体组分和溶剂，树脂前体组分是单体组分中的至少一种，包括二胺化合物、二羰基化合物和/或四羧酸二酐；以及具有重复单元的前体聚合物。
• ENERGY-SENSITIVE RESIN COMPOSITION
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20150338734A1

  公开（公告）日：2015-11-26

  The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.
• ADHESIVE COMPOSITION AND DISPLAY DEVICE
  申请人：SAMSUNG DISPLAY CO., LTD.

  公开号：US20170025485A1

  公开（公告）日：2017-01-26

  An adhesive composition includes: a binder component; a photo-initiator component; and an anaerobic-initiator component. The binder component includes a monomer, an oligomer, and a plasticizer; the photo-initiator component includes a photo-radical initiator and a photo-base generator (PBG); and the anaerobic-initiator component includes a metal reactive initiator, an accelerator, and an inhibitor.
• US7427678B2
  申请人：——

  公开号：US7427678B2

  公开（公告）日：2008-09-23