4-hydroxyphenylbenzyl methylsulfonium trifluoromethane sulfonate

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 有机磺酸及其衍生物
• 英文名称: 4-hydroxyphenylbenzyl methylsulfonium trifluoromethane sulfonate
• 英文别名: Benzyl-(4-hydroxyphenyl)-methylsulfanium;trifluoromethanesulfonate
• 化学式: CF₃O₃S*C₁₄H₁₅OS
• 分子量: 380.409
• InChiKey: YJPLHYFFLWBLDW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.25
• 重原子数：
  24
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  86.8
• 氢给体数：
  1
• 氢受体数：
  7

反应信息

• 作为产物：
  描述：

  4-(甲硫基)苯酚 以 醋酸异丙酯 、 水 为溶剂， 反应 20.5h， 生成 4-hydroxyphenylbenzyl methylsulfonium trifluoromethane sulfonate
  参考文献：
  名称：

  JP5897871

  摘要：

  公开号：

文献信息

• SILOXANE-BASED RESIN COMPOSITION
  申请人：Suwa Mitsuhito

  公开号：US20100316953A1

  公开（公告）日：2010-12-16

  The present invention is a siloxane-based resin composition including a siloxane-based resin and an imidosilane compound having a specific structure. Moreover, the present invention is a siloxane-based resin composition including a siloxane-based resin which is a reactive product to be obtained by hydrolyzing an alkoxysilane compound and an imidosilane compound having a specific structure and then making the resulting hydrolysate undergo a condensation reaction. According to the present invention, it is possible to form a cured film excellent in adhesion.

  本发明是一种基于硅氧烷的树脂组合物，包括一种基于硅氧烷的树脂和一种具有特定结构的亚氨基硅烷化合物。此外，本发明还是一种基于硅氧烷的树脂组合物，包括一种基于硅氧烷的树脂，该树脂是通过水解烷氧基硅烷化合物和具有特定结构的亚氨基硅烷化合物反应产生的反应产物，然后使所得到的水解产物经历缩合反应而得到的。根据本发明，可以形成具有优异附着力的固化膜。
• SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1942150A1

  公开（公告）日：2008-07-09

  A siloxane resin composition comprising a siloxane compound and 1-t-butoxy-2-propanol is provided as a siloxane resin composition capable of being applied onto a substrate with a level difference and good in the capability to cover the level difference of the substrate.

  提供了一种由硅氧烷化合物和 1-t-丁氧基-2-丙醇组成的硅氧烷树脂组合物，作为一种硅氧烷树脂组合物，该组合物能够涂抹在有水平差的基底上，并具有良好的覆盖基底水平差的能力。
• SILOXANE RESIN COMPOSITIONS
  申请人：Toray Industries, Inc.

  公开号：EP2239301A1

  公开（公告）日：2010-10-13

  The present invention is a siloxane-based resin composition including a siloxane-based resin and an imidosilane compound having a specific structure. Moreover, the present invention is a siloxane-based resin composition including a siloxane-based resin which is a reactive product to be obtained by hydrolyzing an alkoxysilane compound and an imidosilane compound having a specific structure and then making the resulting hydrolysate undergo a condensation reaction. According to the present invention, it is possible to form a cured film excellent in adhesion.

  本发明是一种硅氧烷基树脂组合物，包括硅氧烷基树脂和具有特定结构的亚氨基硅烷化合物。此外，本发明是一种硅氧烷基树脂组合物，包括硅氧烷基树脂，该硅氧烷基树脂是通过水解具有特定结构的烷氧基硅烷化合物和亚胺硅烷化合物，然后使所得水解物发生缩合反应而得到的反应产物。根据本发明，可以形成附着力极佳的固化薄膜。
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
  申请人：Toray Industries, Inc.

  公开号：EP3203320A1

  公开（公告）日：2017-08-09

  To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6). 7.5≤X≤75 2.5≤Y≤40 1.5×Y≤X≤3×Y

  提供一种光敏树脂组合物，该组合物能够形成具有高分辨率的图案并获得具有优异的耐热性和抗裂性的固化膜，而且还可进行碱显影；提供一种方法，该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤；以及提供一种使用该组合物制造半导体器件的方法。公开了一种包括聚硅氧烷(A)的光敏树脂组合物，其中聚硅氧烷(A)是由通式(1)表示的聚硅氧烷，且(X)和(Y)由通式(4)至(6)表示。7.5≤x≤75 2.5≤y≤40 1.5×y≤x≤3×y
• Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10409163B2

  公开（公告）日：2019-09-10

  To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).

  提供一种光敏树脂组合物，该组合物能够形成高分辨率的图案并获得具有优异耐热性和抗裂性的固化膜，而且还可进行碱显影；提供一种方法，该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤；以及提供一种使用该组合物制造半导体器件的方法。本发明公开了一种包括聚硅氧烷（A）的光敏树脂组合物。