Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device
申请人:TORAY INDUSTRIES, INC.
公开号:US10409163B2
公开(公告)日:2019-09-10
To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).
提供一种光敏树脂组合物,该组合物能够形成高分辨率的图案并获得具有优异耐热性和抗裂性的固化膜,而且还可进行碱显影;提供一种方法,该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤;以及提供一种使用该组合物制造半导体器件的方法。本发明公开了一种包括聚硅氧烷(A)的光敏树脂组合物。