申请人:Designer Molecules, Inc.
公开号:US20130187095A1
公开(公告)日:2013-07-25
The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.
该发明基于发现,含有某些低粘度、单乙烯不饱和单体的粘合剂组合物具有出人意料的良好固化参数,固化后重量损失非常小。这些单官能单体中的许多单体,单独或与本文所述的其他单官能单体组合使用时,固化后具有较高的玻璃化转变温度。此外,由于这些单体是单官能的,粘合剂组合物的交联密度不会增加(相对于多官能单体),这反过来导致应力更低、模量更低的粘合剂组合物。因此,这些单体在各种热固性粘合剂组合物中都很有用,例如,铸模粘合剂组合物。