3.3'-Bis-trifluormethyl-4.4'-diamino-diphenylsulfon | 5914-09-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3.3'-Bis-trifluormethyl-4.4'-diamino-diphenylsulfon
• 英文别名: Bis[4-amino-3-trifluoromethylphenyl]sulfone；4-[4-amino-3-(trifluoromethyl)phenyl]sulfonyl-2-(trifluoromethyl)aniline
• CAS: 5914-09-0
• 化学式: C₁₄H₁₀F₆N₂O₂S
• 分子量: 384.302
• InChiKey: KRAXRCRORAUEGY-UHFFFAOYSA-N

物化性质

• 熔点：
  156-157 °C
• 沸点：
  495.5±45.0 °C(Predicted)
• 密度：
  1.541±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.1
• 重原子数：
  25
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.14
• 拓扑面积：
  94.6
• 氢给体数：
  2
• 氢受体数：
  10

反应信息

• 作为产物：
  描述：

  5-氯-2-硝基三氟甲苯 在 镍 potassium dichromate 、 硫酸 、 氢气 、 potassium ethyl xanthogenate 作用下， 生成 3.3'-Bis-trifluormethyl-4.4'-diamino-diphenylsulfon
  参考文献：
  名称：

  抗疟药。8.环取代的双（4-氨基苯基）砜及其前体。

  摘要：

  DOI：

  10.1021/jm00294a006

文献信息

• ACETYLENE COMPOUND, SALT THEREOF, CONDENSATE THEREOF, AND COMPOSITION THEREOF
  申请人：Fujifilm Corporation

  公开号：EP2202220A1

  公开（公告）日：2010-06-30

  [Problem to be Solved] To provide an acetylene compound having a structure in which a unit having an amino group and a unit having an ethynyl group are bonded via a linking group, the acetylene compound being introducable to a polymer having thermal resistance. [Means for Solving the Problem] An acetylene compound represented by the following Formula (1) and a salt thereof: wherein in Formula (1), X represents a single bond or a divalent linking group; A represents a hydrocarbon group, a heteroaromatic ring or a heteroalicyclic compound; B represents a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a single bond; R1 represents a hydrogen atom, a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a silyl group; R4 represents a hydrogen atom or a group that can be a substituent of an amino group; and m, n and a each independently represent an integer of 1 or greater.

  解决的问题是提供一种乙炔化合物，其结构中含有通过连接基团连接的具有氨基团和乙炔基团的单元，该乙炔化合物可引入到具有热阻抗的聚合物中。解决问题的方法是通过以下式（1）表示的乙炔化合物及其盐：其中在式（1）中，X代表单键或二价连接基团；A代表烃基团、杂环芳香环或杂环脂环化合物；B代表烃基团、杂环芳香环、杂环脂环化合物或单键；R1代表氢原子、烃基团、杂环芳香环、杂环脂环化合物或硅基团；R4代表氢原子或可作为氨基团的取代基团；m、n和a分别独立表示大于或等于1的整数。
• POLYAMIC ACID RESIN SOLUTION CONTAINING INTERPENETRATING POLYMER AND LAMINATE USING THE SAME
  申请人：WANG Tsung-Hsiung

  公开号：US20130171459A1

  公开（公告）日：2013-07-04

  Provided is a polyamic acid resin solution containing interpenetrating polymer. The solution includes a polyamic acid resin dissolved in a solvent. The polyamic acid resin includes an interpenetrating polymer formed of polyamic acid twining around hyper-branched polybismaleimide. The hyper-branched polybismaleimide includes a bismaleimide polymer, a bismaleimide oligomer, a barbituric acid-bismaleimide copolymer or combinations thereof.

  提供的是一种含有相互渗透聚合物的聚酰亚胺树脂溶液。该溶液包括在溶剂中溶解的聚酰亚胺树脂。聚酰亚胺树脂包括由聚酰亚胺绕绕着超支化聚双马来酰亚胺形成的相互渗透聚合物。超支化聚双马来酰亚胺包括双马来酰亚胺聚合物、双马来酰亚胺寡聚物、巴比妥酸-双马来酰亚胺共聚物或其组合。
• OPTICAL MEMBERS MADE OF POLYIMIDE RESINS
  申请人：Mitsui Chemicals, Inc.

  公开号：EP1237015A1

  公开（公告）日：2002-09-04

  For providing a polyimide optical component exhibiting good physical properties inherent to a polyimide, i.e., heat resistance, mechanical properties, electric properties, thermal oxidation stability and chemical resistance, as well as good transparency and a high refractive index, this invention, this invention essentially uses a particular diamine and a particular tetracarboxylic dianhydride to give an optical component made of a polyimide having a motif represented by general formula (1):    wherein in general formula (1), A represents general formula (2), (3) or (4); X represents a direct bond, -O-, -SO2- or -C(CF3)2-; in general formula (2), R1 and R2 represent H, Cl, Br, CH3 or CF3; in general formula (3), A1 represents -O-, -S-, -CO-, -CH2-, -SO2-, -C(CH3)2- or -C(CF3)2-; in general formula (4), A2 represents a direct bond, -O-, -S-, -CO-, -SO2-, -C(CH3)2- or -C(CF3)2-.

  为了提供一种聚酰亚胺光学元件，使其具有聚酰亚胺固有的良好物理性能，即耐热性、机械性能、电性能、热氧化稳定性和耐化学性，以及良好的透明度和高折射率，本发明主要使用一种特定的二胺和一种特定的四羧酸二酐，以得到一种由具有通式（1）表示的图案的聚酰亚胺制成的光学元件： 其中，在通式（1）中，A 代表通式（2）、（3）或（4）；X 代表直接键、-O-、-SO2- 或-C(CF3)2-； 通式（2）中，R1 和 R2 代表 H、Cl、Br、CH3 或 CF3； 通式（3）中，A1 代表-O-、-S-、-CO-、-CH2-、-SO2-、-C(CH3)2- 或-C(CF3)2-； 通式（4）中，A2 代表直接键、-O-、-S-、-CO-、-SO2-、-C(CH3)2- 或 -C(CF3)2-。
• ACETYLENE COMPOUND
  申请人：Fujifilm Corporation

  公开号：EP2202221A1

  公开（公告）日：2010-06-30

  The invention provides an acetylene compound represented by the following Formula (1), which is useful as a raw material for a polymer achieving high thermal resistance; wherein, in Formula (1), the encircled Ar represents an aryl group or a heteroaryl group; X represents a divalent linking group; R, R' and R1 each independently represent a hydrogen atom, a hydrocarbon group or a heterocyclic group; R2 represents a hydrogen atom or a substituent substitutable on a benzene ring; A represents a hydrocarbon group or a heterocyclic group; Q represents a hydrogen atom, a hydrocarbon group, or a metal element capable of forming a monovalent metal salt; a represents an integer from 0 or more; b, m and n each independently represent an integer of 1 or more; when n, m and b are 1 at the same time, X is not -(C=O)O-; and when n is 2, and both m and b are 1, X is not -O-.

  本发明提供了一种由下式（1）表示的乙炔化合物，它可用作具有高耐热性的聚合物的原料； 其中，在式(1)中，环绕的 Ar 代表芳基或杂芳基；X 代表二价连接基团；R、R'和 R1 各自独立地代表氢原子、烃基或杂环基团；R2 代表氢原子或可取代苯环的取代基；A 代表烃基或杂环基团；Q代表氢原子、烃基或能形成一价金属盐的金属元素；a代表0或0以上的整数；b、m和n各自独立地代表1或1以上的整数；当n、m和b同时为1时，X不是-(C=O)O-；当n为2且m和b均为1时，X不是-O-。
• Multilayer film for electronic circuitry applications
  申请人：E I DU PONT DE NEMOURS AND COMPANY

  公开号：US11021606B2

  公开（公告）日：2021-06-01

  In a first aspect, a multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide, and a second outer layer including a second thermoplastic polyimide. The polyimide of the core layer includes a first aromatic dianhydride including 3,3′,4,4′-biphenyl tetracarboxylic dianhydride and a first aromatic diamine including p-phenylenediamine. The multilayer film has a total thickness in a range of from 5 to 150 μm. A thickness of the core layer is in a range of from 35 to 73% of the total thickness of the multilayer film. A minimum peel strength for at least one of the first and second outer layers, when adhered to copper foil and tested following ASTM method IPC-TM-650, method No. 2.4.9B, is greater than 0.9 kgf/cm (0.88 N/mm). In a second aspect, a metal-clad laminate includes the multilayer film of the first aspect and a first metal layer adhered to an outer surface of the first outer layer of the multilayer film.

  在第一方面，多层薄膜包括第一外层（包括第一热塑性聚酰亚胺）、芯层（包括聚酰亚胺）和第二外层（包括第二热塑性聚酰亚胺）。芯层的聚酰亚胺包括第一芳香族二酐（包括 3,3′,4,4′-联苯四羧酸二酐）和第一芳香族二胺（包括对苯二胺）。多层薄膜的总厚度在 5 至 150 微米之间。芯层的厚度为多层膜总厚度的 35% 至 73%。当第一层和第二层外层中的至少一层粘附在铜箔上并按照 ASTM 方法 IPC-TM-650，方法 No.2.4.9B 进行测试时，其最小剥离强度大于 0.9 kgf/cm（0.88 N/mm）。在第二方面，金属包覆层压板包括第一方面的多层薄膜和粘附在多层薄膜第一外层外表面的第一金属层。