Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
申请人:TAIWAN UNION TECHNOLOGY CORPORATION
公开号:US10689512B2
公开(公告)日:2020-06-23
A resin composition is provided. The resin composition comprises the following:
(a) a resin system, which comprises a thermosetting resin constituent and a vinyl-containing elastomer and has a dissipation factor (Df) of not higher than 0.008 at 10 GHz after curing; and
(b) a phosphorous-containing flame retardant, which is a compound of formula (I), a compound of formula (II), or a combination thereof:
wherein R1, R2, R21, R22, R23, R24, and n are as defined in the specification.
提供一种树脂组合物。该树脂组合物包括以下成分:
(a) 一种树脂系统,它由热固性树脂成分和含乙烯基的弹性体组成,固化后在 10 千兆赫时耗散因子(Df)不高于 0.008;以及
(b) 含磷阻燃剂,它是式 (I) 化合物、式 (II) 化合物或它们的组合:
其中 R1、R2、R21、R22、R23、R24 和 n 如说明书中所定义。