Tandem Type Polymerization. Synthesis and Characterization of Ordered Poly(amide−thioether) from 2,6-Dichlorophenyl Methacrylate, 4,4‘-Thiobis(benznenethiol), and 4,4‘-Oxydianiline
作者:Kousuke Tsuchiya、Yuji Shibasaki、Mitsuru Ueda
DOI:10.1021/ma025712j
日期:2003.3.1
Ordered poly(amide-thioether) (17) was prepared by tandem type polymerization of 2,4-dichlorophenyl acrylate (11), 4,4'-thiobis(benznenthiol) (12), and 4,4'-oxydianiline (16). The polymerization was carried out by mixing all monomers in the presence of catalytic amounts of triethylamine (TEA) and 1-hydroxybenzotriazole (HOBt) in 1-methyl-2-pyrrolidinone (NMP) at 20 degreesC for 2 h and then 80 degreesC for 2 days, yielding polymer 17 with a number-average molecular weight (M.) of 25 000. Authentic ordered poly(amide-thioether) (18) was prepared to verify the structure of polymer 17. The microstructure of polymers obtained was investigated by H-1 and C-13 NMR spectroscopy, and it has been found the polymer obtained has the expected ordered structure. Furthermore, model reactions were studied in detail to demonstrate the feasibility of ordered polymer formation.
Reactions of α,β-Unsaturated Thioesters with Platinum(0): Implication of a Dual Mechanism Leading to the Formation of Acyl Platinum
The moderate reactivity of the alpha,beta-unsaturated thioester (ArS) C(O) C(A)-C(B)(H) toward Pt(PPh3)(2)( C2H4) has been used to extract thermodynamic and kinetic information pertaining to the oxidative addition of alpha,beta-unsaturated acid halide derivatives to low-valent transition-metal complexes. The results indicate acyl platinum product complexes can form by direct C-S bond cleavage or by attack of coordinated Pt(PPh3)(2) on the beta-carbon.
EP1624001A1
申请人:——
公开号:EP1624001A1
公开(公告)日:2006-02-08
PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME
申请人:Taiyo Ink Manufacturing Co. Ltd
公开号:EP1624001B1
公开(公告)日:2008-04-16
Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof
申请人:Kakinuma Masahisa
公开号:US20060058412A1
公开(公告)日:2006-03-16
A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa.s at 25° C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.