Compounds of Formula I that inhibit microsomal triglyceride transfer protein (MTP) and/or apolipoprotein B (Apo B) secretion and their uses in the treatment of diseases linked thereto in animals are described herein.
Identification of a Surprising Boronic Acid Homocoupling Process in Suzuki–Miyaura Cross-Coupling Reactions Utilizing a Hindered Fluorinated Arene
作者:Samantha L. Gargaro、Bre'Shon Dunson、Joshua D. Sieber
DOI:10.1055/s-0040-1707266
日期:——
arylboronic acids was evaluated and determined to suffer from the formation of large amounts of boronicacidhomocoupling products in conjunction with dehalogenation. Homocoupling product formation in this process likely occurs through a rare protonolysis/second transmetalation event rather than by the well-established mechanism requiring the involvement of O2. The scope of this boronicacid homocoupling
NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT
申请人:KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
公开号:US20160194449A1
公开(公告)日:2016-07-07
The present invention relates to a polyamideimide comprising an asymmetric dicarboxylic acid derivative wherein, from among a cyclic group A and a cyclic group B, two substitutents groups R and R′ are bonded only to the cyclic group A on one side. A polymer produced by means of the present invention can have adequate solubility with respect to organic solvents, high thermal stability, a high glass transition temperature, high transparency and a low thermal expansion coefficient, and is able not only to satisfy requirements for core substrate materials of flexible displays but also to be used as a material for various soft electronic data devices.
[EN] NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT<br/>[FR] NOUVEAU POLYAMIDE-IMIDE PRÉSENTANT UN FAIBLE COEFFICIENT D'EXPANSION THERMIQUE
申请人:KOREA ADVANCED INST SCI & TECH
公开号:WO2014104557A1
公开(公告)日:2014-07-03
본 발명은 두 개의 치환기 R 및 R'가 고리그룹A와 고리그룹B 중 한쪽의 고리그룹A에만 결합되어 있는 것을 특징으로 하는 비대칭 디카르복실산 유도체를 포함하는 폴리아미드이미드에 관한 것이다. 본 발명에 의해 제조된 고분자는 유기 용매에 대한 충분한 용해도와 높은 열적 안정성, 높은 유리전이온도, 높은 투명도 및 낮은 열팽창계수를 가질 수 있어, 플렉시블 디스플레이의 핵심 기판소재로의 요구조건을 만족시킬 뿐만 아니라 다양한 유연성 전자정보소자 물질로 응용이 가능하다.