D-(-)-N,N-bis-(2-hydroxy-ethyl)-2-amino-propionic acid | 21145-64-2

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: D-(-)-N,N-bis-(2-hydroxy-ethyl)-2-amino-propionic acid
• 英文别名: N,N-bis-(2-hydroxy-ethyl)-L-alanine；N,N-Bis-(2-hydroxy-aethyl)-L-alanin；(2S)-2-[bis(2-hydroxyethyl)amino]propanoic acid
• CAS: 21145-64-2
• 化学式: C₇H₁₅NO₄
• 分子量: 177.2
• InChiKey: HPAOINJNCZZVSP-LURJTMIESA-N

物化性质

• 熔点：
  153-155 °C(Solv: ethanol (64-17-5))
• 沸点：
  383.3±27.0 °C(Predicted)
• 密度：
  1.253±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  -3.4
• 重原子数：
  12
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  81
• 氢给体数：
  3
• 氢受体数：
  5

反应信息

• 作为反应物：
  描述：

  D-(-)-N,N-bis-(2-hydroxy-ethyl)-2-amino-propionic acid 在 Cu-doped zirconium dioxide 、 sodium hydroxide 作用下， 以 水 为溶剂， 反应 62.25h， 以89.6%的产率得到methylglycine-N,N-diacetic acid trisodium salt
  参考文献：
  名称：

  制备氨基多羧酸盐的方法

  摘要：

  本发明涉及一种制备氨基多羧酸盐的方法，其中从相应的多链烷醇胺开始通过在催化剂的存在下和使用碱进行催化氧化脱氢，所述催化剂含有基于催化剂总重量计的1-90重量%的铜。此方法的特征在于先使多链烷醇胺在140-180℃的温度下进行部分转化得到含有氨基多羧酸盐的反应混合物，直到至少10-90摩尔%的多链烷醇胺已经反应。然后在升高的温度下继续进行所述转化。

  公开号：

  CN103547561B
• 作为产物：
  描述：

  环氧乙烷 、 L-丙氨酸 在 sodium hydroxide 作用下， 以 水 为溶剂， 反应 15.5h， 以15.634 kg的产率得到D-(-)-N,N-bis-(2-hydroxy-ethyl)-2-amino-propionic acid
  参考文献：
  名称：

  制备氨基多羧酸盐的方法

  摘要：

  本发明涉及一种制备氨基多羧酸盐的方法，其中从相应的多链烷醇胺开始通过在催化剂的存在下和使用碱进行催化氧化脱氢，所述催化剂含有基于催化剂总重量计的1-90重量%的铜。此方法的特征在于先使多链烷醇胺在140-180℃的温度下进行部分转化得到含有氨基多羧酸盐的反应混合物，直到至少10-90摩尔%的多链烷醇胺已经反应。然后在升高的温度下继续进行所述转化。

  公开号：

  CN103547561B

文献信息

• AQUEOUS POLYURETHANE RESIN DISPERSION AND PROCESS FOR PREPARING THE SAME
  申请人：Nakamura Taku

  公开号：US20110136976A1

  公开（公告）日：2011-06-09

  This is to provide an aqueous polyurethane resin dispersion which can form a tough coating film. An aqueous polyurethane resin dispersion is obtained by dispersing an aqueous polyurethane resin, which is obtained by reacting (A) a polyurethane prepolymer obtained by reacting (a1) a polycarbonate polyol having no urethane bonding having an average molecular weight of 400 to 5000, and having 2.05 to 5 hydroxyl groups in average in one molecule, (b) a polyol compound having an acidic group and (c) a polyisocyanate, or obtained by reacting (a2) the polycarbonate polyol having no urethane bonding having an average molecular weight of 600 to 5000, and having 2.05 to 5 hydroxyl groups in average in one molecule, and having an acidic group, and (c) a polyisocyanate, and (B) a chain elongating agent having a reactivity with the isocyanate group of (A) the polyurethane prepolymer, being dispersed in an aqueous medium.

  本发明提供了一种能够形成坚韧涂层膜的水性聚氨酯树脂分散体。通过将水性聚氨酯树脂分散在水介质中得到。所述水性聚氨酯树脂是通过反应得到的，反应物包括：（A）聚氨酯预聚体，所述聚氨酯预聚体是由以下反应物反应得到的：（a1）分子量为400到5000的聚碳酸酯多元醇，其中每个分子平均具有2.05到5个羟基；（b）具有酸性基团的多元醇化合物；（c）多异氰酸酯；或者是由以下反应物反应得到的：（a2）分子量为600到5000的聚碳酸酯多元醇，其中每个分子平均具有2.05到5个羟基和一个酸性基团；（c）多异氰酸酯；（B）链延长剂，其与（A）聚氨酯预聚体的异氰酸酯基团具有反应性。
• AQUEOUS POLYURETHANE RESIN DISPERSION AND USE THEREOF
  申请人：Morikami Atsushi

  公开号：US20130317171A1

  公开（公告）日：2013-11-28

  An aqueous polyurethane resin dispersion is a dispersion of a polyurethane resin in an aqueous medium, the polyurethane resin being obtained by reacting (A) a polyurethane prepolymer obtained by reacting (a) a polyisocyanate compound, (b) a polyol compound including a polycarbonate polyol with a number average molecular weight of 400 to 3000, (c) an acidic group-containing polyol compound and (d) a blocking agent, with (B) a chain extender, the total content of urethane bonds and urea bonds being 7 to 15 wt %, the content of carbonate bonds being 15 to 40 wt %, the content of ether bonds being 0.5 to 5 wt %, the content of isocyanate groups bonded to the blocking agent being 0.2 to 2.0 wt %, each of these contents being based on solid contents, the acid value being 10 to 16 mg KOH/g. The aqueous polyurethane resin dispersion can form coating films which permit new application while exhibiting excellent water resistance and solvent resistance. A coating composition includes the dispersion. A polyurethane resin film is obtained by thermally drying a composition including the dispersion.

  一种水性聚氨酯树脂分散液是一种在水介质中分散的聚氨酯树脂分散液，聚氨酯树脂是通过反应（A）聚氨酯预聚物获得的，该预聚物是由（a）聚异氰酸酯化合物，（b）包括分子量为400至3000的聚碳酸酯多元醇的聚醇化合物，（c）含有酸性基团的聚醇化合物和（d）阻断剂反应而成，与（B）链延伸剂反应，尿素键和氨基酸键的总含量为7至15重量％，碳酸酯键的含量为15至40重量％，醚键的含量为0.5至5重量％，与阻断剂结合的异氰酸酯基团的含量为0.2至2.0重量％，这些含量均基于固体含量，酸值为10至16毫克KOH/克。水性聚氨酯树脂分散液可以形成涂层膜，具有优异的耐水性和耐溶剂性，同时允许新的应用。涂层组成物包括该分散液。通过热干燥包括该分散液的组成物可以获得聚氨酯树脂膜。
• HEAT CURABLE RESIN COMPOSITION, OVERCOATING AGENT FOR FLEXIBLE CIRCUIT BOARD, AND SURFACE PROTECTIVE FILM
  申请人：Showa Denko K.K.

  公开号：EP1997843A1

  公开（公告）日：2008-12-03

  Overcoating agents and thermosetting resin compositions of the invention give protective layers that have excellent adhesion to substrates and in particular to tin, excellent long-term reliability of electric insulation and small warpage. A thermosetting resin composition according to the invention includes a carboxyl group-containing urethane resin (A), a curing agent (B) and an acid anhydride (C) as essential components. A flexible circuit board overcoating agent includes the thermosetting resin composition. A surface protective layer of the invention comprises a cured product of the thermosetting resin composition.

  本发明的涂层剂和热固性树脂组合物提供的保护层与基材，特别是与锡的附着力极佳，具有极佳的长期电绝缘可靠性和较小的翘曲。根据本发明，一种热固性树脂组合物包括一种含羧基的聚氨酯树脂（A）、一种固化剂（B）和一种酸酐（C）作为基本成分。柔性电路板涂层剂包括热固性树脂组合物。本发明的表面保护层包括热固性树脂组合物的固化产物。
• THERMOSETTING RESIN COMPOSITION AND USE THEREOF
  申请人：Showa Denko K.K.

  公开号：EP2017307A1

  公开（公告）日：2009-01-21

  Thermosetting resin compositions are excellent in balance among printability, tack properties, matting properties, electrical insulating properties and adhesion to objects. A thermosetting resin composition includes a thermosetting resin (A) and core-shell multilayer organic fine particles (B).

  热固性树脂组合物在印刷性、粘性、消光性、电绝缘性和与物体的粘附性之间具有良好的平衡性。热固性树脂组合物包括热固性树脂（A）和芯壳多层有机微粒（B）。
• THERMOSETTING RESIN COMPOSITION CONTAINING LOW-CHLORINE MULTIFUNCTIONAL ALIPHATIC GLYCIDYL ETHER COMPOUND, CURED PRODUCT OF SUCH COMPOSITION AND USE THEREOF
  申请人：Showa Denko K.K.

  公开号：EP2031023A1

  公开（公告）日：2009-03-04

  An object of the invention is to provide a thermosetting resin composition having excellent low temperature curing properties, tack properties, flexibility and electric properties, cured products made from the composition and uses thereof. The thermosetting resin composition of the invention comprises (A) a thermosetting resin, preferably a carboxyl group containing resin, and (B) a polyfunctional aliphatic glycidyl ether compound having a total chlorine amount of less than 0.7 % by mass. The cured products of the thermosetting resin composition is used as insulating protective coating films for printed wiring boards, flexible printed wiring boards, chip on films and the like.

  本发明的目的是提供一种具有优异的低温固化性能、粘性、柔韧性和电性能的热固性树脂组合物，以及由该组合物制成的固化产品及其用途。本发明的热固性树脂组合物包括：(A) 热固性树脂，最好是含羧基的树脂；(B) 多官能团脂肪族缩水甘油醚化合物，其总氯量小于 0.7%（质量百分比）。热固性树脂组合物的固化产品可用作印刷线路板、柔性印刷线路板、芯片薄膜等的绝缘保护涂层薄膜。