4,4'-diamino-2,2',3,3',6,6'-hexafluorobiphenyl

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-diamino-2,2',3,3',6,6'-hexafluorobiphenyl
• 英文别名: 2,2′,3,3′,6,6′-hexafluorobiphenyl-4,4′-diamine；4-(4-Amino-2,3,6-trifluorophenyl)-2,3,5-trifluoroaniline；4-(4-amino-2,3,6-trifluorophenyl)-2,3,5-trifluoroaniline
• 化学式: C₁₂H₆F₆N₂
• 分子量: 292.183
• InChiKey: UVJXASLHNGDGTJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  20
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  52
• 氢给体数：
  2
• 氢受体数：
  8

反应信息

• 作为反应物：
  描述：

  4,4'-diamino-2,2',3,3',6,6'-hexafluorobiphenyl 、 甘油 在 ferrous(II) sulfate heptahydrate 、 硫酸 、 硼酸 、 3-硝基苯磺酸水合物 作用下， 反应 5.0h， 以60%的产率得到5,5',7,7',8,8'-hexafluoro-6,6'-biquinoline
  参考文献：
  名称：

  多氟4-乙酰氨基联苯的邻氢脱氟和多氟6-苯基喹啉的合成

  摘要：

  在Zn–NiCl 2 –2,2'-联吡啶–aq中，多氟代4-乙酰氨基-和4,4'-双（乙酰氨基）联苯被还原。DMF系统首次合成了较少的含氟类似物，其中含一个或两个与乙酰胺基邻位的未取代位置。通过涉及邻-未被取代的，得到4-乙酰氨基或4- aminopolyfluorobiphenyls在Skraup合成，新多氟化6- phenylquinolines和6,6'-联喹啉。

  DOI：

  10.1016/j.jfluchem.2013.09.015
• 作为产物：
  描述：

  4,4′-bis(acetamido)-2,2′,3,3′,5,5′,6,6′-octafluorobiphenyl 在 2,2'-联吡啶 、 nickel(II) chloride hexahydrate 、 锌 、 水 、 sodium hydroxide 作用下， 以 水 、 N,N-二甲基甲酰胺 为溶剂， 反应 4.0h， 以20%的产率得到4,4'-diamino-2,2',3,3',5',6,6'-heptafluorobiphenyl
  参考文献：
  名称：

  多氟4-乙酰氨基联苯的邻氢脱氟和多氟6-苯基喹啉的合成

  摘要：

  在Zn–NiCl 2 –2,2'-联吡啶–aq中，多氟代4-乙酰氨基-和4,4'-双（乙酰氨基）联苯被还原。DMF系统首次合成了较少的含氟类似物，其中含一个或两个与乙酰胺基邻位的未取代位置。通过涉及邻-未被取代的，得到4-乙酰氨基或4- aminopolyfluorobiphenyls在Skraup合成，新多氟化6- phenylquinolines和6,6'-联喹啉。

  DOI：

  10.1016/j.jfluchem.2013.09.015

文献信息

• Polyimide resin, polyimide solution, film, and method for producing same
  申请人：KANEKA CORPORATION

  公开号：US10745519B2

  公开（公告）日：2020-08-18

  A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.

  本发明的聚酰亚胺树脂含有至少一种脂环族酸酐作为酸酐组分，并含有至少一种含磺酰基二胺作为二胺组分。含有本发明聚酰亚胺树脂的薄膜的黄度最好为 3.0 或以下，拉伸弹性模量为 3.5 GPa 或以上，铅笔硬度为 4H 或以上，波长为 400 纳米时的透光率为 60% 或以上。本发明的聚酰亚胺树脂和本发明的薄膜的玻璃化温度最好为 300 摄氏度或更高。
• OPTICAL FILM, OPTICAL FILM MANUFACTURING METHOD, TRANSPARENT SUBSTRATE, IMAGE DISPLAY DEVICE, AND SOLAR CELL
  申请人：Hasegawa Masatoshi

  公开号：US20120270999A1

  公开（公告）日：2012-10-25

  An optical film that is excellent not only in transparency and heat resistance but also in solubility in an organic solvent and linear thermal expansion coefficient. Also, a product or a member which meets high demands for heat resistance and low linear thermal expansion coefficient with the use of the optical film, more specifically a transparent substrate using the optical film, and an image display device and a solar cell including the optical film or the transparent substrate. The optical film contains a polyimide having a specific structure in which a repeating unit of a chain of a polymer has both an amide group and an imide group and the polymer has a fluorine atom. The polyimide is obtained by mixing a dehydrating agent and an imidizing agent with a polyamic acid solution so as to imidize the polyamic acid.
• DIAMINE, POLYIMIDE, AND POLYIMIDE FILM AND UTILIZATION THEREOF
  申请人：KANEKA CORPORATION

  公开号：US20150011726A1

  公开（公告）日：2015-01-08

  Provided are (i) a polyimide which is transparent and has an excellent solution processability, a high heat resistance, and a low linear thermal expansion coefficient, and (ii) a polyimide film of the polyimide. According to the present invention, it is possible to produce, by use of a novel diamine characterized in having an amide group and a trifluoromethyl group, the polyimide which is transparent and has the excellent solution processability, the high heat resistance, and the low linear thermal expansion coefficient. The polyimide can be applied to various electronic devices such as an electronic display device.
• POLYIMIDE RESIN, POLYIMIDE SOLUTION, FILM, AND METHOD FOR PRODUCING SAME
  申请人：KANEKA CORPORATION

  公开号：US20190153158A1

  公开（公告）日：2019-05-23

  A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4 H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.
• POLYIMIDE RESIN, PRODUCTION METHOD FOR POLYIMIDE RESIN, POLYIMIDE FILM, AND PRODUCTION METHOD FOR POLYIMIDE FILM
  申请人：KANEKA CORPORATION

  公开号：US20210115192A1

  公开（公告）日：2021-04-22

  A polyimide resin has an acid dianhydride-derived structure and a diamine-derived structure, the acid dianhydride contains an acid dianhydride represented by the general formula (1) and a fluorine-containing aromatic acid dianhydride, and the diamine contains a fluoroalkyl-substituted benzidine. In the general formula (1), n is an integer of 1 or more, and R 1 to R 4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or a perfluoroalkyl group having 1 to 20 carbon atoms. The content of the acid dianhydride represented by the general formula (1) may be 10 to 65 mol %, and the content of the fluorine-containing aromatic acid dianhydride may be 30 to 80 mol %, based on 100 mol % of the total of the acid dianhydride.