2-[1-(Oxiran-2-ylmethoxy)pentan-3-yloxymethyl]oxirane

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 环氧化物
• 英文名称: 2-[1-(Oxiran-2-ylmethoxy)pentan-3-yloxymethyl]oxirane
• 英文别名: 2-[1-(oxiran-2-ylmethoxy)pentan-3-yloxymethyl]oxirane
• 化学式: C₁₁H₂₀O₄
• 分子量: 216.27
• InChiKey: JXTFDTQMVVSUNQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.6
• 重原子数：
  15
• 可旋转键数：
  9
• 环数：
  2.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL
  申请人：DIC Corporation

  公开号：EP2832759A1

  公开（公告）日：2015-02-04

  The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.

  本发明提供了一种具有低熔点、低熔融粘度、优异的溶剂溶解性和优异的加工性的环氧树脂。此外，本发明还提供了一种环氧树脂组合物及其固化产品，具有优异的流动性、加工性、柔韧性、粘附性和导热性。环氧树脂由以下通式（I）表示（Q：具有 C1-C9 直链部分的亚烷基链，其侧链中可能含有一个 C1-C18 烷基，或在亚烷基链中的两个连续亚甲基之间存在一个醚键的连接链；A：直接或通过连接链键合 2 至 4 个亚苯基的亚苯基单元，或萘基单元，n：0 至 10）。环氧树脂组合物包含环氧树脂和固化剂。组合物包括环氧树脂。
• EPOXY RESIN, METHOD FOR PRODUCING EXPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL
  申请人：DIC Corporation

  公开号：US20150104651A1

  公开（公告）日：2015-04-16

  The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.
• US9441069B2
  申请人：——

  公开号：US9441069B2

  公开（公告）日：2016-09-13