Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
提供了热固性
树脂组合物,可用于安装在电路板上的半导体器件,例如芯片尺寸或芯片规模封装(“C
SP”),球栅阵列(“BGA”),陆地栅格阵列(“LGA”)等(统称为“子组件”),或半导体芯片。当受到适当条件的影响时,该组合物的反应产物可被可控地重做。