Novel resin composition, coating material comprising said resin composition and method for forming coatings
申请人:Asahi Kasei Kogyo Kabushiki Kaisha
公开号:EP0052330A1
公开(公告)日:1982-05-26
A resin composition comprising (A) a polymer having, in the molecule, at least two groups represented by the following structural formula (I):
wherein R1 is isopropyl, sec-butyl, tert-butyl, a C2-20 alkyl group, a C3-20 cycloalkyl group, a C5-20 alkenyl group, a C3-20 hydroxyalkyl group, a C5-20 alkoxyalkyl group, a C3-20 aminoalkyl group, a C6-20 aryl group or a C6-20 arylalkyl group, and n is 0, 1 or 2, and (B) a polymer having an electron attractive group and an α,β-ethylenic double bond adjacent thereto. Though said composition is stable at room temperature, it is crosslinked and cured at high temperatures because the amino group of the polymer (A) adds to the double bond of the polymer (B). Accordingly, said resin composition is suitable for use as a cathodic electrocoating material.
一种树脂组合物,包含(A)一种聚合物,其分子中至少有两个由以下结构式(I)代表的基团:
其中 R1 为异丙基、仲丁基、叔丁基、C2-20 烷基、C3-20 环烷基、C5-20 烯基、C3-20 羟烷基、C5-20 烷氧基烷基、C3-20 氨基烷基、C6-20 芳基或 C6-20 芳烷基,n 为 0、1 或 2;以及 (B) 具有引电子基团和邻接α,β-乙烯双键的聚合物。虽然所述组合物在室温下稳定,但由于聚合物(A)的氨基与聚合物(B)的双键相加,因此在高温下会发生交联和固化。因此,所述树脂组合物适合用作阴极电涂层材料。