申请人:AIR PRODUCTS AND CHEMICALS, INC.
公开号:EP2284250A1
公开(公告)日:2011-02-16
The present invention is a method of cleaning to removal residue in semiconductor manufacturing processing, comprising contacting a surface to be cleaned with an aqueous formulation having a polymer selected from the group consisting of acrylamido-methyl-propane sulfonate polymers, acrylic acid-2-acrylamido-2-methylpropane sulfonic acid copolymer and mixtures thereof and a quaternary ammonium hydroxide having greater than 4 carbon atoms or, where the formulation does not contain an acetylinic surfactant, choline hydroxide.
The present invention is also a post-CMP cleaning formulation having the components set forth in the method above.
本发明是一种清除半导体制造加工过程中残留物的清洗方法,包括将待清洗表面与一种水性配方接触,该配方中的聚合物选自丙烯酰胺基甲基丙烷磺酸盐聚合物、丙烯酸-2-丙烯酰胺基-2-甲基丙烷磺酸共聚物及其混合物和具有大于 4 个碳原子的氢氧化季铵,或在配方不含乙酰表面活性剂的情况下,氢氧化胆碱。
本发明也是一种具有上述方法所述成分的后 CMP 清洗配方。