Tri-(p-isopropylphenyl)phosphin | 29949-82-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Tri-(p-isopropylphenyl)phosphin
• 英文别名: Tri-p-cumylphosphin；Phosphine, tris(4-(1-methylethyl)phenyl)-；tris(4-propan-2-ylphenyl)phosphane
• CAS: 29949-82-4
• 化学式: C₂₇H₃₃P
• 分子量: 388.533
• InChiKey: NTUMNRFLAZXNBW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8
• 重原子数：
  28
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

反应信息

• 作为反应物：
  描述：

  Tri-(p-isopropylphenyl)phosphin 在 potassium tert-butylate 作用下， 以 甲苯 为溶剂， 反应 48.0h， 生成
  参考文献：
  名称：

  Bandmann, Heinz; Bartik, Tamas; Bauckloh, Sylvia, Zeitschrift fur Chemie, 1990, vol. 30, # 6, p. 193 - 204

  摘要：

  DOI：

文献信息

• Oligomerization catalyst for alpha-olefins and process for oligomerizing alpha-olefins
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0531174A2

  公开（公告）日：1993-03-10

  An oligomerization catalyst for α-olefins, comprising [A] at least one nickel compound selected from the group consisting of a nickel salt of organic acid, a nickel salt of inorganic acid and a complex compound of nickel; [B] an organoaluminum oxy-compound having at least 3 aluminum atoms in the molecule; and [C] a trivalent phosphorous compound represented by the general formula PR¹R²R³ wherein R¹ to R³ are each independently a hydrocarbon group or substituted hydrocarbon group of 1 to 10 carbon atoms. A process for oligomerizing α-olefin, wherein α-olefin is oligomerized in the presence of the catalyst mentioned above.

  一种α-烯烃的低聚催化剂，包括 [A] 至少一种镍化合物，选自由有机酸镍盐、无机酸镍盐和镍的复合物组成的组； [B] 分子中含有至少 3 个铝原子的有机铝氧化合物；以及 [C] 由通式 PR¹R²R³ 表示的三价磷化合物，其中 R¹ 至 R³ 分别独立地为 1 至 10 个碳原子的烃基或取代烃基。 一种使α-烯烃低聚的工艺，其中α-烯烃在上述催化剂存在下进行低聚。
• Epoxy resin composition and electronic component device
  申请人：Hitachi Chemical Company, Ltd.

  公开号：US10865332B2

  公开（公告）日：2020-12-15

  An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

  一种环氧树脂组合物包括(A) 含有下式（I）所代表化合物的环氧树脂； (B) 含有下式（II）所代表化合物的苯酚树脂；以及 (C) 含有下式（III）所代表化合物的二羟基萘化合物。在式（I）中，R 代表氢原子，n 代表 0 至 10 的整数。在式（II）中，R1 代表氢原子、具有 1 至 6 个碳原子的烷基或具有 1 或 2 个碳原子的烷氧基，且每个 R1 可与另一个 R1 相同或不同，n 代表 0 至 10 的整数。在式（III）中，R1 代表氢原子、具有 1 至 6 个碳原子的烷基或具有 1 或 2 个碳原子的烷氧基。
• Encapsulating epoxy resin composition, and electronic parts device using the same
  申请人：Ikezawa Ryoichi

  公开号：US20050222300A1

  公开（公告）日：2005-10-06

  There is disclosed an encapsulating epoxy resin composition, containing an epoxy resin (A), a curing agent (B), and a composite metal hydroxide (C), and having a mold release force under shearing after 10 shots of molding which is less than or equal to 200 KPa. The resin composition is preferably applied for encapsulating a semiconductor device having at least one of features including: (a) at least one of an encapsulating material of an upper side of a semiconductor chip and an encapsulating material of a lower side of the semiconductor chip has a thickness less than or equal to 0.7 mm; (b) a pin count is greater than or equal to 80; (c) a wire length is greater than or equal to 2 mm; (d) a pad pitch on the semiconductor chip is less than or equal to 90 (m; (e) a thickness of a package, in which the semiconductor chip is disposed on a mounting substrate, is less than or equal to 2 mm; and (f) an area of the semiconductor chip is greater than or equal to 25 mm2.

  本发明公开了一种封装环氧树脂组合物，该组合物含有环氧树脂（A）、固化剂（B）和复合金属氢氧化物（C），成型 10 次后的剪切脱模力小于或等于 200 KPa。该树脂组合物最好用于封装半导体器件，该器件具有以下至少一个特征：(a) 半导体芯片上侧的封装材料和半导体芯片下侧的封装材料中至少有一种的厚度小于或等于 0.7 毫米；(b) 引脚数大于或等于 80 个；(c) 导线长度大于或等于 2 毫米；(d) 半导体芯片上的焊盘间距小于或等于 90 米；(e) 封装厚度小于或等于 2 毫米，其中半导体芯片放置在安装基板上；以及 (f) 半导体芯片的面积大于或等于 25 平方毫米。
• EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2762511B1

  公开（公告）日：2016-11-16
• Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device
  申请人：Ikezawa Ryoichi

  公开号：US20080039556A1

  公开（公告）日：2008-02-14

  The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) contains magnesium hydroxide coated with silica, and provides a non-halogenated and non-antimony encapsulated epoxy-resin molding compound superior in flame resistance moldability and also in reliability such as reflow resistance, moisture resistance, high-temperature storage stability, and thus, favorable for sealing VLSI, and an electronic component device carrying an element sealed with the molding compound.