The invention is based on the discovery that certain well-defined compounds derived from pentacyclopentadecane dimethanol are useful components in adhesive formulations. In particular, the invention compounds described herein provide high Tg values and low shrinkage. Compounds of the invention are useful as adhesives for use in the semiconductor packaging industry.
这项发明基于发现,从五环十五碳二
甲醇中得到的某些明确定义的化合物可作为胶粘剂配方中的有用组分。具体来说,本发明所述的化合物具有高Tg值和低收缩率。本发明的化合物可作为半导体封装行业中使用的胶粘剂。